A 3D printing packaging method for flip chips

A flip-chip and 3D printing technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems that flip-chips cannot see the back shape, the thermal conductivity of the insulating layer material is not good, and the overall effect of the lamp is not very good. , to achieve the effect of high degree of freedom, low manufacturing cost, and cost reduction
CN106410011BInactive Publication Date: 2019-03-26GUANGDONG DELI PHOTOELECTRIC
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGDONG DELI PHOTOELECTRIC
Publication Date
2019-03-26
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The present invention provides a 3D printing packaging method of a flip chip. The method is characterized by comprising the following steps of S1 utilizing a computer to design a three-dimensional digital model of an LED device, programming the LED device, after the hierarchical slicing processing, introducing a 3D printer, and utilizing the computer to control the hierarchical printing; S2 utilizing a suction nozzle to absorb the flip chip, and fixing under a reflector cup; S3 carrying out the 3D printing on a solder layer and a radiating substrate, wherein the radiating substrate is equipped with a leading-out circuit in electrode connection with the chip, and further can comprises a step S4 of filling the fluorescent powder. Relative to the general packaging, according to the present invention, the die bonding wires and the eutectic solders are not needed, the packaging yield is improved, a support and a PCB or a COB do not need to purchase, the packaging cost is reduced, the packaging research and development cycle is shortened, and the packaging appearance diversity is increased, and the LED thinning and miniaturization are promoted.
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Description

technical field

[0001] The invention relates to the technical field of LED packaging, in particular to a flip-chip 3D printing packaging method. Background technique

[0002] The existing flip chip has a cross-sectional structure such as figure 1 As shown, the specific packaging method is carried out according to the following steps: S1: making the chip (2), the epitaxial layer of the chip (2) is made with a reflective layer and a multi-layer insulating layer, and the asymmetric electrode is made into two through the metal expansion layer. Symmetrical electrode; S2: use eutectic soldering or solder paste soldering to connect the chip electrode (3) and the lead-out circuit (9) with the solder layer (7), so that the flip chip (2) is fixed on the heat dissipation substrate (6); S3: filling material (8) under the electrode; S4: filling phosphor (10). Due to the limitation of the shape of the flip chip, there are the following problems: 1. For the flip chip, in order to improve...

Claims

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