Enhanced photoresist structure based on glass fibers and manufacturing method thereof

A glass fiber and woven glass fiber technology is applied in the field of glass fiber-based reinforced photoresist structure and its production, which can solve the problem of poor light transmittance, unsatisfactory mechanical properties, and influence on photolithography molding of fillers such as carbon and graphite. and other problems, to achieve the effect of improving tensile modulus and breaking strength, low cost and perfect development

Active Publication Date: 2020-02-14
SHANGHAI JIAO TONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the poor mechanical properties of SU-8 photoresist as a structural material, the existing enhancements are not ideal for improving the mechanical properties of photoresist, and the light transmission of carbon, graphite and other fillers is not good. Compared with SU-8 photoresist After compounding the glue, it will affect its photolithographic molding. According to one embodiment of the present invention, a glass fiber-based reinforced photoresist structure is provided, including:

Method used

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  • Enhanced photoresist structure based on glass fibers and manufacturing method thereof
  • Enhanced photoresist structure based on glass fibers and manufacturing method thereof
  • Enhanced photoresist structure based on glass fibers and manufacturing method thereof

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Embodiment Construction

[0033] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0034] In this specification, reference to "one embodiment" or "the...

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Abstract

The invention discloses an enhanced photoresist structure based on glass fibers and a manufacturing method of the enhanced photoresist structure. The structure includes: glass fibers; and a photoresist, wherein the glass fiber is coated with the photoresist. Compared with the prior art, the enhanced photoresist structure based on the glass fibers has the following advantages: 1) the tensile modulus and breaking strength of the photoresist are improved, so the application of the photoresist as a structural material to an MEMS technology is expanded; 2) the photoresist is guaranteed to have highutilization rate of light energy, and the composite structure has no influence on photosensitive characteristics of the photoresist; 3) the exposure and development modes of the photoresist are not changed, and photoetching forming of the photoresist is not affected; 4) exposed glass fibers can be removed by a hydrofluoric acid wet method; and 5) the method is simple in process and low in cost.

Description

technical field [0001] The invention relates to the technical field of electronic and semiconductor materials and photoresist, in particular to a reinforced photoresist structure based on glass fiber for application and micro-electromechanical system manufacturing and a manufacturing method thereof. Background technique [0002] SU-8 photoresist is a negative-working epoxy-based near-UV photoresist material. It can form an adhesive layer with a thickness of hundreds of microns by one spin coating, and has low light absorption in the near ultraviolet range, so it can obtain thick film patterns with vertical side walls and high aspect ratios. In addition, because the SU-8 photoresist is compatible with many different material manufacturing processes, it has good thermal stability and corrosion resistance, and can be self-leveled during the pre-baking process, eliminating the beading effect on the edge, light weight, It is easy to process and has a wide range of applications i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/038
CPCG03F7/004G03F7/0382
Inventor 周文文王惟圣丁桂甫高峰王广元蔡涵
Owner SHANGHAI JIAO TONG UNIV
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