Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Diode with NTC temperature detection and preparation method thereof

A technology of diodes and testing experiments, applied in the field of diodes, can solve problems such as chip damage, achieve the effects of reducing loss, ensuring normal operation, and improving work efficiency

Inactive Publication Date: 2020-02-14
启明星半导体技术(西安)有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of the accuracy of temperature measurement and prevent damage to chips sensitive to temperature during the temperature measurement process, the invention provides a method for preparing a diode with NTC temperature detection, comprising the following steps:

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diode with NTC temperature detection and preparation method thereof
  • Diode with NTC temperature detection and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] This embodiment provides a method for preparing a diode with NTC temperature detection. First, the chip and the NTC are bonded together on the DCB substrate, and then the leads are bonded to both ends of the chip and the NTC, and then the internal structure of the diode is packaged. Material packaging to isolate it from the outside. After the packaging is completed, use electroplating equipment to plate metal on the leads, then cut off the excess leads, and bend the remaining leads. After the above steps are completed, the finished product is tested and tested. The preparation is completed if the test is passed. Diode with NTC temperature detection.

[0030] Beneficial effects of this embodiment: the diode made by this method is isolated from the outside because the chip and NTC are packaged together in the diode, so that the temperature of the chip detected by the NTC is more accurate, and the loss during chip operation can be reduced, improving work efficiency.

Embodiment 2

[0032] On the basis of Example 1, this example provides that the method of bonding the chip and NTC on the DCB substrate in step (a) is soldering, and the temperature range is 235°C-255°C. This example uses 235°C ℃, the adhesive material is a mixture of tin-based alloy and rosin; using this method of bonding can make the chip and NTC bonded to the DCB substrate more firmly and not easy to fall off.

Embodiment 3

[0034] On the basis of Example 1, combined with Figure 1-2 , the material of DCB substrate 1 in the present embodiment is by top layer Cu plate 103, middle layer Al 2 o 3 The layer 102 and the bottom Cu board 101 are stacked in sequence, and the top Cu board 103 is provided with a T-shaped notch, which can prevent the short circuit of NTC3 and ensure that chip 2 and NTC3 will not communicate with each other when there is a close enough distance, thereby ensuring that NTC3 normal work.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of diodes, and particularly discloses a preparation method of a diode with NTC temperature detection. The preparation method comprises the steps of die bonding, wire bonding, packaging, electroplating, rib cutting and testing. The method is simple and low in cost. The prepared diode comprises a chip, an NTC and a DCB substrate which are packaged together. The DCB substrate is composed of a bottom Cu plate, a middle Al2O3 layer and a top Cu plate. The top Cu plate is provided with a T-shaped notch. The chip is bonded on one side of the top Cu plate,and the NTC is bonded on the other side of the top Cu plate. By adopting the diode with NTC temperature detection, the temperature of the chip can be tested more accurately, and the service life of the chip can be prolonged.

Description

technical field [0001] The invention belongs to the technical field of diodes, in particular to a diode with NTC temperature detection and a preparation method thereof. Background technique [0002] The chip is significantly affected by temperature, so it is very important to make the chip work at a suitable temperature. However, because the chip is too small and packaged in a diode, we cannot directly measure its working temperature through conventional methods, and need to use NTC temperature detection; NTC (Negative Temperature Coefficient) means that the resistance decreases exponentially with temperature rise, and has A thermistor phenomenon and material with a negative temperature coefficient, the ambient temperature can be obtained by measuring its resistance. [0003] In the prior art, the temperature of the chip is measured by placing the NTC outside the diode. Although this operation is simple and easy, the measured temperature will be quite different from the act...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L23/498H01L25/00H01L29/861H01C7/00H01C7/04
CPCH01C7/008H01C7/04H01L21/50H01L23/49838H01L23/49844H01L25/00H01L29/861
Inventor 关赫
Owner 启明星半导体技术(西安)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com