Reflow welding process simulation model correction method based on heating factor

A simulation model and welding process technology, applied in the field of reflow welding process simulation model correction based on heating factor, can solve the problems of inaccurate simulation of reflow welding process temperature field model, etc.

Pending Publication Date: 2020-02-21
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

According to the solder joint temperature data obtained from the test, the simulation model of the reflow soldering process temperature field is corrected to obtain

Method used

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  • Reflow welding process simulation model correction method based on heating factor
  • Reflow welding process simulation model correction method based on heating factor
  • Reflow welding process simulation model correction method based on heating factor

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[0044] Examples:

[0045] Such as figure 1 As shown, a reflow welding process simulation model correction method based on heating factor includes the following steps:

[0046] Step 1. Establish a simulation model of the process temperature field:

[0047] First of all, according to the physical view of a printed board PCBA assembly Figure 2a And 1809EXL hot-air reflow soldering furnace in 12 temperature zones, using finite element simulation software to establish a temperature field simulation model of reflow soldering process. The temperature field simulation model of reflow soldering process mainly includes printed board PCBA substrate, BGA body, QFP body, Chip Component equivalent thermal model and equivalent thermal model of BGA, QFP high-density assembly solder joints; PCBA component finite element simulation model see Figure 2b ; PCBA transient temperature field numerical simulation model; then, the transient thermal simulation analysis, assuming that the reflow soldering fu...

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Abstract

The invention discloses a reflow welding process simulation model correction method based on a heating factor. The method comprises the following steps: establishing a numerical simulation correctionmodel which takes minimization of the time difference between a heating factor and a hyperliquidus as an optimization target and takes temperature of a temperature zone and a convective heat transfercoefficient as optimization variables by analyzing the time difference between the heating factor and the hyperliquidus of actually measured temperature data and corresponding numerical simulation temperature data; optimizing the model by adopting a response surface method and a multi-objective genetic optimization algorithm method, so that the result of the numerical simulation model is consistent with the actually measured temperature, the corrected numerical simulation model is obtained, and the accuracy of subsequent simulation prediction can be improved through feedback adjustment of one-time physical test. According to the method, the reflow welding process simulation model is corrected by a method of combining finite element simulation and tests, so that the simulation efficiency and precision are effectively improved.

Description

technical field [0001] The invention belongs to the technical field of reflow soldering process simulation finite element model correction, and in particular relates to a heating factor-based reflow soldering process simulation model correction method. Background technique [0002] With the rapid development of the integrated circuit industry, high integration and high reliability have become a new trend in the industry. Driven by this trend, Surface Mounted Technology (SMT) for electronic circuits has opened up broad prospects for the further miniaturization, thinning and lightweighting of electronic products, especially aerospace and military electronic equipment. Reflow (reflow) soldering is a key process in the surface mount technology (SMT) production process. The reflow soldering process directly affects the soldering quality and reliability of electronic products. At present, the method of "temperature measuring plate test - process parameter adjustment" is generall...

Claims

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Application Information

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IPC IPC(8): G06F30/23
Inventor 龚雨兵尹钰田郑毅沈鸿桥周红达陈蔡
Owner GUILIN UNIV OF ELECTRONIC TECH
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