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Printing method of thick copper plate

A printing method and thick copper plate technology, which is applied in the field of PCB manufacturing, can solve the problems of inability to guarantee the ink thickness requirements of lines and corners, low production efficiency, and high product defect rate, so as to avoid rough appearance, high production efficiency, and reduce ink defects. Effect

Inactive Publication Date: 2020-02-21
东莞市鸿运电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the copper thickness of the outer layer is 2oz, the copper thickness of the finished product is greater than 70um. At this time, when the silk screen solder mask is used, one printing can no longer guarantee the ink thickness requirements of the line surface and corners, and it is generally necessary to print the solder mask twice.
When using traditional methods to print thick copper plates (2oz), there are often hidden quality problems such as skipping printing and printing oil.
At present, some factories use the method of secondary solder mask printing or exposure process to print, but the secondary solder mask printing will waste ink, which is likely to cause quality risks such as oil leakage, resulting in unqualified phenomena and resulting in a high defect rate of products. Exposure process The process is cumbersome, the production efficiency is low, and the cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: a kind of thick copper plate printing method that this embodiment provides, it comprises the following steps:

[0023] The first step is to prepare the negative solder resist line mask film and screen, which specifically includes increasing the entire line by 0.75mm, then removing it by increasing the line size by 0.15mm, and finally removing it with the shape and the solder resist block at the discharge pin , forming a negative solder resist line mask, and changing the line width of less than 0.24mm to 0.24mm and then photo-painting film; according to the negative solder resist line mask film, the solder resist and screen are required, and it is required to use a 100T screen plate with a tension of 30N.

[0024] In the second step, after material cutting and surface grinding, line etching is carried out; next, printing is carried out, and surface grinding is carried out before and after printing. It is required to use 180# / 2.8A±0.2A for brushing; 180# / 2.8A...

Embodiment 2

[0030] Embodiment 2: The printing method of the thick copper plate provided by this embodiment is basically the same as Embodiment 1, the difference is that: in the step 3, it also includes filling ink in the through hole of the circuit board after metallization, abrasive belt Grinding removes the resin protruding from the board surface behind the plug hole. The solder resist in the hole is likely to cause too much residual ink accumulated on the screen. Print the residual ink into the hole under the pressure of the scraper, and select a suitable printing filling ink. During silk screen printing, the viscosity of the screen printing filling ink should be controlled in the range of ≥400dpa.s Inside, ensure the infiltration amount of selectively filled silk screen printing ink, and ensure that the filled ink surface is flush with the copper surface of the thick copper PCB board. The filler ink comprises the following components by weight: 45 parts of ethoxylated trimethylolpropa...

Embodiment 3

[0031] Embodiment 3: The printing method of the thick copper plate provided by this embodiment is basically the same as Embodiment 1, the difference is that: in the step 3, it also includes filling ink in the through hole of the circuit board after metallization, and an abrasive belt Grinding removes the resin protruding from the board surface behind the plug hole. The solder resist in the hole is likely to cause too much residual ink accumulated on the screen. Print the residual ink into the hole under the pressure of the scraper, and select a suitable printing filling ink. During silk screen printing, the viscosity of the screen printing filling ink should be controlled in the range of ≥400dpa.s Inside, ensure the infiltration amount of selectively filled silk screen printing ink, and ensure that the filled ink surface is flush with the copper surface of the thick copper PCB board. The filling ink is made of the following components by weight: 40 parts of ethoxylated trimeth...

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Abstract

The invention discloses a printing method of a thick copper plate. The printing method of the thick copper plate comprises the following steps of: preparing a negative film solder resist line mask film and a screen printing plate, performing cutting, carrying out surface grinding treatment, and carrying out circuit etching; printing the negative film solder resist line mask, wherein the UV light curing energy value of the negative film solder resist line mask is 1700 + / -500 mj / cm2, and the black matrix solder resist UV light curing energy value is 2200 + / -400 mj / cm 2; carrying out solder resist and single-sided or double-sided character silk-screen printing after the negative film solder resist line mask is completed; and completing the steps after performing punching, molding and surfacetreatment. Compared with the prior art, the printing method is low in cost, easy and convenient to operate and high in production efficiency, and the defects of blistering, oil seepage or rough appearance caused by solder mask and the like can be avoided.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a printing method for a thick copper plate, mainly a printing method for a single-sided PCB thick copper plate (2 oz). Background technique [0002] Printed circuit board (PCB circuit board) is the provider of electrical connection of electronic components, mainly composed of the following: lines and drawings. The line is used as a tool for conducting between components, and a large copper surface is additionally designed as a grounding and power supply layer in the design. In recent years, thick copper plates have been used more and more in the manufacture of copper clad laminates, and some high-power LED aluminum substrates and power supply substrates are also more inclined to use thick copper foil substrates in the design and production. However, for high-thick copper with high speed, high frequency, large current capacity, miniaturization, and high heat dissipation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/28H05K2203/1377
Inventor 夏善福
Owner 东莞市鸿运电子有限公司
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