Printing method of thick copper plate

A printing method and thick copper plate technology, which is applied in the field of PCB manufacturing, can solve the problems of inability to guarantee the ink thickness requirements of lines and corners, low production efficiency, and high product defect rate, so as to avoid rough appearance, high production efficiency, and reduce ink defects. Effect
CN110831345AInactive Publication Date: 2020-02-21东莞市鸿运电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
东莞市鸿运电子有限公司
Publication Date
2020-02-21
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention discloses a printing method of a thick copper plate. The printing method of the thick copper plate comprises the following steps of: preparing a negative film solder resist line mask film and a screen printing plate, performing cutting, carrying out surface grinding treatment, and carrying out circuit etching; printing the negative film solder resist line mask, wherein the UV light curing energy value of the negative film solder resist line mask is 1700 + / -500 mj / cm2, and the black matrix solder resist UV light curing energy value is 2200 + / -400 mj / cm 2; carrying out solder resist and single-sided or double-sided character silk-screen printing after the negative film solder resist line mask is completed; and completing the steps after performing punching, molding and surfacetreatment. Compared with the prior art, the printing method is low in cost, easy and convenient to operate and high in production efficiency, and the defects of blistering, oil seepage or rough appearance caused by solder mask and the like can be avoided.
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Description

technical field

[0001] The invention relates to the technical field of PCB manufacturing, in particular to a printing method for a thick copper plate, mainly a printing method for a single-sided PCB thick copper plate (2 oz). Background technique

[0002] Printed circuit board (PCB circuit board) is the provider of electrical connection of electronic components, mainly composed of the following: lines and drawings. The line is used as a tool for conducting between components, and a large copper surface is additionally designed as a grounding and power supply layer in the design. In recent years, thick copper plates have been used more and more in the manufacture of copper clad laminates, and some high-power LED aluminum substrates and power supply substrates are also more inclined to use thick copper foil substrates in the design and production. However, for high-thick copper with high speed, high frequency, large current capacity, miniaturization, and high heat dissipation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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