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Preparation method based on sub-rapid solidification and used for Cu-Ni-Si alloy strip

A sub-rapid solidification, cu-ni-si technology, applied in the field of metallurgy, can solve the problems of slow cooling rate of alloy solidification structure, coarse grains of initial solidification structure, and easy segregation, so as to improve solid solution efficiency, save resources, The effect of improving the yield

Inactive Publication Date: 2020-02-28
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are still many problems in the preparation process: the main reason is that in the traditional hot rolling process, the cooling rate of the alloy solidification structure is slow, resulting in coarse grains and serious microsegregation of the initial solidification structure, which requires long-term homogenization treatment. The metallographic picture of the solidification structure of the process ingot is as follows figure 1 As shown in (a), the metallographic picture of the cast strip solidification structure is as follows figure 1 As shown in (b), the distribution of ingot structure segregation is as follows figure 2 shown
[0006] In the prior art, the preparation of Cu-Ni copper alloys needs to go through tedious processes such as homogenization and hot rolling, and problems such as segregation are prone to occur

Method used

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  • Preparation method based on sub-rapid solidification and used for Cu-Ni-Si alloy strip
  • Preparation method based on sub-rapid solidification and used for Cu-Ni-Si alloy strip
  • Preparation method based on sub-rapid solidification and used for Cu-Ni-Si alloy strip

Examples

Experimental program
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Effect test

Embodiment 1

[0041] Cu-Ni-Si alloy melt is smelted according to the designed composition, and its composition contains 3.2% Ni, 0.75% Si, impurity ≤ 0.05%, and the rest is Cu;

[0042] The molten Cu-Ni-Si alloy melt enters the tundish through the gate, the superheat is controlled at 55°C, the tundish preheating temperature is 1100°C, and then poured into the twin-roll strip casting machine through the tundish for continuous casting to obtain the thickness For a 3.0mm cast strip, the solidification rate during the continuous casting process reaches 1100°C / s, and the cast strip is cooled by spraying water immediately after it comes out of the casting roll, and the cooling rate of the cast strip is controlled at 70°C / s; the liquid level is controlled at 60mm during the continuous casting process, and the roll The rotation speed is 40m / min; the distribution diagram of cast strip structure segregation (electronic probe) is as follows image 3 As shown, the grain boundary distribution diagram of...

Embodiment 2

[0046] Method is with embodiment 1, and difference is:

[0047] (1) Cu-Ni-Si alloy melt, its composition contains Ni 2.5%, Si 0.5% by mass percentage;

[0048] (2) Control superheat to 85°C, tundish preheating temperature to 1150°C, casting strip thickness to 2.0mm, cooling rate after casting strip exiting casting rolls to 75°C / s; control liquid level to 70mm during continuous casting, roll speed to 45m / s min, the solidification structure CSL grain boundary of the cast strip is 1.93%;

[0049] (3) The total reduction rate of cold rolling is 90%; the thickness of cold rolled thin strip is 0.2mm;

[0050] (4) The temperature of aging treatment is 450°C, and the time is 2h. The metallographic picture after aging treatment is as follows Figure 7 As shown, the Cu-Ni-Si alloy strip has a tensile strength of 750MPa, an electrical conductivity of 33%IACS, and a hardness of 230HV.

Embodiment 3

[0052] Method is with embodiment 1, and difference is:

[0053] (1) Cu-Ni-Si alloy melt, its composition contains Ni 3.0%, Si 0.6% by mass percentage;

[0054] (2) Control superheat to 95°C, tundish preheating temperature to 1200°C, casting strip thickness to 4.0mm, cooling rate after casting strip exiting casting rolls to 75°C / s; control liquid level to 90mm during continuous casting, roll speed to 40m / s min, the solidification structure CSL grain boundary of the cast strip is 2.31%;

[0055] (3) The total reduction rate of cold rolling is 95%; the thickness of cold rolled thin strip is 0.2mm;

[0056] (4) The aging treatment temperature is 500°C and the time is 3h. The metallographic picture after aging treatment is as follows Figure 8 As shown, the Cu-Ni-Si alloy strip has a tensile strength of 700MPa, an electrical conductivity of 35% IACS, and a hardness of 218HV.

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Abstract

The invention discloses a preparation method based on sub-rapid solidification and used for a Cu-Ni-Si alloy strip. The preparation method based on the sub-rapid solidification and used for the Cu-Ni-Si alloy strip comprises the following steps: smelting a Cu-Ni-Si alloy melt according to design components, and then pouring the Cu-Ni-Si alloy melt into a tundish; controlling a superheating degree;pouring the Cu-Ni-Si alloy melt into a twin-roll strip casting-rolling machine through the tundish and carrying out continuous casting; discharging a cast strip from rolls and then cooling the cast strip into a thick cast strip with a thickness of 0.5-5.0mm; carrying out short-time solid solution and then carrying out multi-pass cold-rolling to obtain a cold-rolled strip; and carrying out aging treatment to obtain the alloy strip. A near-net-shape strip can be directly formed from molten metal, so that in the method, the processes of homogenizing annealing, hot-rolling and the like in a traditional process can be omitted, the flow is shortened, and the initial solidification structure of the cast strip is refined through the sub-rapid solidification, so that a grain boundary tends to be developed to a special Sigma3 large-angle grain boundary; meanwhile, the supersaturated solid solubility of Si in a Cu matrix is increased, and the segregation of Ni and Si is effectively suppressed; and meanwhile, the tensile strength after the aging is not less than 700MPa, the electric conductivity is not less than 25%IACS, and the strip with excellent comprehensive performance is finally obtained on the basis of saving energy and reducing emission, simplifying the process, and reducing the production cost.

Description

Technical field: [0001] The invention belongs to the technical field of metallurgy, and in particular relates to a method for preparing Cu-Ni-Si alloy strips based on subrapid solidification. Background technique: [0002] With the development of communications, electronics, and electric power industries, not only the demand for copper alloy strips has increased sharply, but also a series of new requirements have been put forward in terms of product quality, such as high precision, high surface, and high performance. However, from the domestic production situation of strips From the point of view, a considerable number of copper strip products are medium and low-grade products. Most of the lead frame copper strips, transformer strips, and white copper strips in high-precision strips rely on imports. Develop the production of high-precision strips in my country and improve product quality. , has become an important task for us at present. [0003] Cu-Ni-Si alloys are typical a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06B22D11/06C22F1/08
CPCB22D11/0622C22C9/06C22F1/002C22F1/08
Inventor 曹光明陈鉴张爽贾飞李成刚王志国刘振宇
Owner NORTHEASTERN UNIV
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