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Method for preparing carbon nanotube film reticular structure for reinforcing water vapor condensation

A carbon nanotube film, network structure technology, applied in steam/steam condensers, lighting and heating equipment, etc., can solve the problems of small range of enhanced heat transfer subcooling, poor stability of condensation surface, complex processing technology, etc. Achieving good water vapor condensation strengthening effect, reducing the separation diameter and chemical stability

Inactive Publication Date: 2020-02-28
CHINA ACADEMY OF SPACE TECHNOLOGY
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Problems solved by technology

However, the above-mentioned condensing surfaces have disadvantages such as poor stability, complex processing technology, and small subcooling range for enhanced heat transfer, and most technical solutions can only process smooth or small curvature condensing surfaces, which limits their application in industrial production. practical application

Method used

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  • Method for preparing carbon nanotube film reticular structure for reinforcing water vapor condensation
  • Method for preparing carbon nanotube film reticular structure for reinforcing water vapor condensation
  • Method for preparing carbon nanotube film reticular structure for reinforcing water vapor condensation

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0031] A three-dimensional carbon nanotube film network structure and a preparation method thereof for enhanced water vapor condensation. By constructing a three-dimensional carbon nanotube film network structure 5 on the surface of the substrate 4, the purpose of strengthening water vapor condensation is achieved. The carbon nanotube thin film network structure 5 material can be covered on various types of material substrates 4 , and the effect of strengthening water vapor condensation and heat transfer can be achieved after simple treatment. The preparation steps of the three-dimensional carbon nanotube film network structure 5 are as follows:

[0032] (1) preparing a single-layer carbon nanotube film 3;

[0033] (2) spreading a pl...

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Abstract

The invention discloses a method for preparing a carbon nanotube film reticular structure for reinforcing water vapor condensation, and belongs to the technical field of water vapor condensation heattransfer reinforcement. The method comprises the following steps that S1, a carbon nanotube vertical array 2 is prepared on a silicon substrate 1; S2, the carbon nanotube vertical array 2 is pulled, so that single-layer carbon nanotube films 3 are formed; S3, the single-layer carbon nanotube films 3 are spread on the substrate 4 in a crossing manner, and the carbon nanotube film reticular structure 5 is manufactured; and S4, multiple carbon nanotube film reticular structures 5 are subjected to water atomization shrinkage reinforcing lamination. The surface of the carbon nanotube film reticularstructure prepared through the method has the advantages of being stable in chemical property, small in additional thermal resistance and the like.

Description

technical field [0001] The invention relates to a three-dimensional carbon nanotube thin film network structure for strengthening water vapor condensation and a preparation method thereof, and belongs to the technical field of water vapor condensation and heat transfer enhancement. Background technique [0002] Water vapor condensation widely exists in various key links in industrial production and life. Water vapor condensation heat transfer is a very important heat transfer method in the fields of nuclear power, air conditioning and refrigeration. Enhancing the heat transfer of water vapor condensation is not only beneficial to improve the working efficiency of related equipment, but also can save the energy consumption and cost of industrial production. At present, it has been confirmed that the heat transfer coefficient of water vapor droplet condensation mode is 5-7 times higher than that of water vapor film condensation mode. Therefore, the condensation surface that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28B3/00
CPCF28B3/00
Inventor 徐彦彤张光李龙姚伟徐昌键温中凯
Owner CHINA ACADEMY OF SPACE TECHNOLOGY
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