Reflow welding process simulation model correction method based on measured temperature data

A simulation model and welding process technology, which is applied in the field of reflow soldering process simulation model correction based on measured temperature data, can solve the problem of inaccurate simulation of reflow soldering process temperature field model

Active Publication Date: 2020-03-06
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

According to the solder joint temperature data obtained from the test, the simulation model of the reflow soldering process temperature field is corrected to obta...

Method used

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  • Reflow welding process simulation model correction method based on measured temperature data
  • Reflow welding process simulation model correction method based on measured temperature data
  • Reflow welding process simulation model correction method based on measured temperature data

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Embodiment

[0018] Such as figure 1 As shown, a reflow soldering process simulation model correction method based on measured temperature data includes the following steps:

[0019] Step 1. Establish a simulation model of the reflow soldering process temperature field, use transient thermal simulation analysis to obtain the simulation temperature curve of the solder joint, take the actual temperature curve as the standard, and use the simulation curve as the input to calculate the standard deviation (S) of the corresponding node temperature;

[0020] Step 2, determine the design parameters, constraints, and objective functions, and establish a PCBA temperature field simulation correction model;

[0021] Step 3, design the experiment, obtain the response value of the target parameter; sample the modified design parameters, and then bring the sampled sample points into the process simulation model before correction, and calculate the target parameter response value of the process parameter ...

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Abstract

The invention discloses a reflow welding process simulation model correction method based on measured temperature data. By analyzing the standard deviation between the actually measured temperature curve data and the correspondingly simulated temperature curve data, a numerical simulation correction model which takes the minimization of the standard deviation between the node temperatures corresponding to the actually measured curve and the simulation curve as an optimization target and takes the temperature of the temperature zone and the convective heat transfer coefficient as optimization variables is established. The model is optimized by adopting a response surface method and a multi-objective genetic optimization algorithm method, so that the result of the numerical simulation modelis consistent with the actually measured temperature, the corrected numerical simulation model is obtained, and the accuracy of subsequent simulation prediction can be improved through feedback adjustment of one-time physical test. According to the method, the reflow welding process simulation model is corrected by a method of combining finite element simulation and tests, so that the simulation efficiency and precision are effectively improved.

Description

technical field [0001] The invention belongs to the technical field of reflow soldering process simulation finite element model correction technology, in particular to a reflow soldering process simulation model correction method based on measured temperature data. Background technique [0002] With the rapid development of the integrated circuit industry, high integration and high reliability have become a new trend in the industry. Driven by this trend, Surface Mounted Technology (SMT) for electronic circuits has opened up broad prospects for the further miniaturization, thinning and lightweighting of electronic products, especially aerospace and military electronic equipment. Reflow (reflow) soldering is a key process in the surface mount technology (SMT) production process. The reflow soldering process directly affects the soldering quality and reliability of electronic products. At present, the method of "temperature measuring plate test - process parameter adjustment...

Claims

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Application Information

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IPC IPC(8): G06F30/23
Inventor 龚雨兵周红达陈蔡尹钰田潘开林郑毅车飞
Owner GUILIN UNIV OF ELECTRONIC TECH
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