Reflow welding process simulation model correction method based on measured temperature data

Abstract

The invention discloses a reflow welding process simulation model correction method based on measured temperature data. By analyzing the standard deviation between the actually measured temperature curve data and the correspondingly simulated temperature curve data, a numerical simulation correction model which takes the minimization of the standard deviation between the node temperatures corresponding to the actually measured curve and the simulation curve as an optimization target and takes the temperature of the temperature zone and the convective heat transfer coefficient as optimization variables is established. The model is optimized by adopting a response surface method and a multi-objective genetic optimization algorithm method, so that the result of the numerical simulation modelis consistent with the actually measured temperature, the corrected numerical simulation model is obtained, and the accuracy of subsequent simulation prediction can be improved through feedback adjustment of one-time physical test. According to the method, the reflow welding process simulation model is corrected by a method of combining finite element simulation and tests, so that the simulation efficiency and precision are effectively improved.

Description

technical field [0001] The invention belongs to the technical field of reflow soldering process simulation finite element model correction technology, in particular to a reflow soldering process simulation model correction method based on measured temperature data. Background technique [0002] With the rapid development of the integrated circuit industry, high integration and high reliability have become a new trend in the industry. Driven by this trend, Surface Mounted Technology (SMT) for electronic circuits has opened up broad prospects for the further miniaturization, thinning and lightweighting of electronic products, especially aerospace and military electronic equipment. Reflow (reflow) soldering is a key process in the surface mount technology (SMT) production process. The reflow soldering process directly affects the soldering quality and reliability of electronic products. At present, the method of "temperature measuring plate test - process parameter adjustment...

AI Technical Summary

Problems solved by technology

According to the solder joint temperature data obtained from the test, the simulation model of the reflow soldering process temperature field is corrected to obtain a more accurate process temperature field simulation model, which solves the problem of inaccurate simulation of the reflow soldering process temperature field model

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