Optical module with fiber winding mechanism

Abstract

The invention provides an optical module with a fiber winding mechanism. The fiber winding mechanism is simple in structure and extremely simple and convenient to operate so that the fiber coiling process becomes simple and feasible, high subsequent reliability can also be ensured and the internal space occupation of the optical module is greatly reduced. The optical module comprises an upper heatdissipation shell and a lower heat dissipation shell which can be spliced into a whole and a PCB which is arranged in the upper heat dissipation shell and the lower heat dissipation shell. A controlchip is arranged on the PCB, a laser device is connected on the PCB, and an optical device is arranged on the front side of the laser. The optical device is connected with an optical fiber, the otherend of the optical fiber is connected with an optical head, the laser and the optical device are respectively arranged on a TEC refrigerator, the TEC refrigerator is installed in a metal heat sink, and an optical fiber adhesion device is correspondingly arranged on the PCB and located on the rear side of the optical device and used for fixing the coiled optical fiber.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an optical module with a fiber winding mechanism. Background technique [0002] At present, the optical devices and optical ports inside many optical modules are transmitted through optical fibers, but the internal space of optical modules is very limited. Now as the optical module speed is getting higher and higher, the size and number of chips have increased, and the space required inside the optical module is even larger. If the internal space is insufficient, there will be the following defects: 1. The PCB size is insufficient, and the chips and other heating electronic components are arranged too tightly, which directly leads to poor heat dissipation; 2. Once the high-frequency related chips or circuits are arranged too compactly, they will also This leads to serious internal crosstalk, which greatly reduces the performance of the optical module. [0003] At ...

AI Technical Summary

Problems solved by technology

If the internal space is insufficient, there will be the following defects: 1. The PCB size is insufficient, and the chips and other heating electronic components are arranged too tightly, which directly leads to poor heat dissipation; 2. Once the high-frequency related chips or circuits are arranged too compactly, they will also It leads to serious internal crosstalk, which greatly reduces the performance of the optical module

[0005] However, the optical fiber has no ductility, and the coiling process is difficult to operate, so it...

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