Aluminum-silicon electronic packaging material and preparation method thereof

An electronic packaging material, aluminum-silicon technology, applied in transportation and packaging, metal processing equipment, etc., can solve the problems of lower yield, easy cracking, high cost, etc., and achieve high density, high sphericity, and controllable particle size.

Active Publication Date: 2020-03-24
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this process has many steps and high cost. At the same time, it is easy to crack during hot forging and hot rolling, which reduces the yield

Method used

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  • Aluminum-silicon electronic packaging material and preparation method thereof
  • Aluminum-silicon electronic packaging material and preparation method thereof
  • Aluminum-silicon electronic packaging material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] (1) An Al-Si alloy powder with a Si content of 20 wt % and a particle size of 1-2 μm prepared by gas atomization is recorded as an Al-20% Si alloy gas atomized powder with a particle size of 1-2 μm.

[0063] (2) Put the Al-Si alloy powder into a rubber sheath, and perform cold isostatic pressing after vibration. The isostatic pressing pressure is 120MPa, and the holding time is 200s.

[0064] (3) Heat the cold isostatic pressed compact, extrusion die and extrusion barrel to 430°C, hold for 0.5h, and perform hot extrusion with an extrusion ratio of 20:1 and an extrusion speed of 1mm / s to obtain aluminum-silicon electronics packaging material.

[0065] Fig. 1 (a) is the SEM image of the Al-20% Si alloy gas atomized powder with a particle size of 1-2 μm in Example 1, as can be seen from the figure, the Al-Si powder has a particle size of 1-2 μm, good sphericity, No obvious defects.

[0066] Figure 2(a) is the SEM image of the aluminum-silicon electronic packaging materia...

Embodiment 2

[0068] (1) An Al-Si alloy powder with a Si content of 20wt% and a particle size of 20-25 μm prepared by gas atomization is recorded as an Al-20% Si alloy gas atomized powder with a particle size of 1-2 μm.

[0069] (2) Put the Al-Si alloy powder into a rubber sheath, and perform cold isostatic pressing after vibration. The isostatic pressing pressure is 120MPa, and the holding time is 200s.

[0070] (3) Heat the cold isostatic pressed compact, extrusion die and extrusion barrel to 430°C, hold for 0.5h, and perform hot extrusion with an extrusion ratio of 20:1 and an extrusion speed of 1mm / s to obtain aluminum-silicon electronics packaging material.

[0071] Fig. 1 (b) is the SEM image of the Al-20% Si alloy gas atomized powder with a particle size of 20-25 μm in Example 2. As can be seen from the figure, the Al-Si powder has a particle size of 20-25 μm and better sphericity. No obvious defects.

[0072] Fig. 2(b) is the SEM image of the aluminum-silicon electronic packaging ...

Embodiment 3

[0076] (1) An Al-Si alloy powder with a Si content of 50 wt % and a particle size of 10-20 μm prepared by gas atomization is recorded as an Al-50% Si alloy gas atomized powder with a particle size of 10-20 μm.

[0077] (2) Put the Al-Si alloy powder into a rubber sheath, and perform cold isostatic pressing after vibration. The isostatic pressing pressure is 80MPa, and the holding time is 300s.

[0078] (3) Heat the cold isostatic pressed compact, extrusion die and extrusion cylinder to 350°C, keep it warm for 1h, and perform hot extrusion with an extrusion ratio of 60:1 and an extrusion speed of 3mm / s to obtain an aluminum-silicon electronic package Material.

[0079] Fig. 1 (c) is the SEM image of the Al-50% Si alloy gas atomized powder with a particle size of 10-20 μm in Example 3. As can be seen from the figure, the particle size of the Al-Si powder is 10-20 μm, and the sphericity is better. No obvious defects.

[0080] Figure 2(c) is the SEM image of the aluminum-silicon...

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Abstract

The invention discloses an aluminum-silicon electronic packaging material and a preparation method thereof. The method comprises the following steps of: 1) preparing aluminum-silicon alloy powder through a gas atomization or melt-spinning process; 2) putting the obtained aluminum-silicon alloy powder into a sheath, performing compacting, and carrying out isostatic cool pressing to obtain an isostatic cool pressing compact; and 3) carrying out hot extrusion by adopting the obtained isostatic cool pressing compact to obtain the aluminum-silicon electronic packaging material. The prepared aluminum-silicon electronic packaging material has the advantages of the high aluminum-silicon alloy density, the high tensile strength, the high elongation and the good thermal conductivity, and the methoddisclosed by the invention can be used for large-scale mass production.

Description

technical field [0001] The invention belongs to the field of aluminum-silicon alloy electronic packaging materials, and relates to an aluminum-silicon electronic packaging material and a preparation method thereof, in particular to an aluminum-silicon electronic packaging material and a powder metallurgy preparation method. Background technique [0002] Since the miniaturization and high power of modern electronic components have led to a sharp increase in the heat generated by integrated circuit chips, the environment in which electronic packaging materials are used has become harsher, such as higher temperatures and more severe cooling and heating cycles. This requires electronic packaging materials to have excellent mechanical properties, high thermal conductivity and low thermal expansion coefficient at high temperatures. At the same time, considering the sealing performance of electronic packaging materials, there are also high requirements for the density of packaging m...

Claims

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Application Information

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IPC IPC(8): C22C21/02C22C1/04B22F9/08B22F3/04B22F3/20B22F1/00
CPCC22C21/02C22C1/0416B22F9/082B22F9/08B22F3/04B22F3/20B22F2009/0824B22F2003/208B22F1/05
Inventor 余鹏丁超
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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