A kind of asymmetric microchip supercapacitor and preparation method thereof

A microchip, asymmetric technology, applied in the manufacture of hybrid/electric double layer capacitors, hybrid capacitor electrodes, multiple hybrid/electric double layer capacitors, etc., can solve the problem of high cost and difficult to achieve precision assembly of asymmetric microchip devices, etc. problems, to achieve the effect of improving efficiency, excellent electrochemical performance, and huge application prospects

Active Publication Date: 2021-11-09
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide an asymmetric microchip supercapacitor and its preparation method, which overcomes the defects of high cost and difficulty in realizing precise assembly of asymmetric microchip devices in the prior art. The present invention uses the anti-template method to prepare PDMS Microchip capacitor substrates, self-assembly of microchip electrodes driven by capillary forces, fabrication of asymmetric microchip capacitors, and subsequent use of PAM / Na 2 SO 4 As an electrolyte, an all-solid-state asymmetric microchip supercapacitor is fabricated

Method used

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  • A kind of asymmetric microchip supercapacitor and preparation method thereof
  • A kind of asymmetric microchip supercapacitor and preparation method thereof
  • A kind of asymmetric microchip supercapacitor and preparation method thereof

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Embodiment 1

[0033] Laser engraving was used to prepare the template of the microchip structure on the PMMA plate, and then PDMS was poured onto the PMMA template to make a PDMS template with groove and gap widths of 500 microns, and the number of interdigitation pairs was 16. Using SWCNTs / PEDOT:PSS / CuHCF slurry as the cathode material precursor, SWCNTs / PEDOT:PSS / Fe 2 o 3 The slurry is used as the precursor of the negative electrode material to assemble the asymmetric microchip supercapacitor. Before assembly, the PDMS substrate was treated in oxygen plasma for 5min (power 50W) to make its surface hydrophilic. Fill 20 μL of SWCNTs / PEDOT:PSS / CuHCF slurry into one of the grooves of the PDMS substrate, and the slurry will spontaneously enter into the interdigitated grooves under the action of capillary force. After drying at room temperature to the state of no flowing water but not completely dry, add 20 μL of SWCNTs / PEDOT:PSS / CuHCF slurry and dry completely at room temperature. 20 μL SWCN...

Embodiment 2

[0036] Laser engraving was used to prepare the template of the microchip structure on the PMMA plate, and then PDMS was poured onto the PMMA template to make a PDMS template with groove and gap widths of 50 microns, and the number of interdigitation pairs was 20. Using SWCNTs / PEDOT:PSS / CuHCF slurry as the cathode material precursor, SWCNTs / PEDOT:PSS / Fe 2 o 3 The slurry is used as the precursor of the negative electrode material to assemble the asymmetric microchip supercapacitor. Before assembly, the PDMS substrate was treated in oxygen plasma for 1 min (power 50W) to make its surface hydrophilic. Fill 20 μL of SWCNTs / PEDOT:PSS / CuHCF slurry into one of the grooves of the PDMS substrate, and the slurry will spontaneously enter into the interdigitated grooves under the action of capillary force. SWCNTs / PEDOT:PSS / Fe 2 o 3 The slurry was filled into the groove on the other side, and repeated 3 times for the self-assembly of the negative interdigitated film. After the device w...

Embodiment 3

[0039] Laser engraving was used to prepare the template of the microchip structure on the PMMA plate, and then PDMS was poured onto the PMMA template to make a PDMS template with groove and gap widths of 100 microns, and the number of interdigitation pairs was 5. Using SWCNTs / PEDOT:PSS / CuHCF slurry as the cathode material precursor, SWCNTs / PEDOT:PSS / Fe 2 o 3 The slurry is used as the precursor of the negative electrode material to assemble the asymmetric microchip supercapacitor. Before assembly, the PDMS substrate was treated in oxygen plasma for 1 min (power 80W) to make its surface hydrophilic. Fill 30 μL of SWCNTs / PEDOT:PSS / CuHCF slurry into one of the large grooves of the PDMS substrate, and the slurry will spontaneously enter into the interdigitated grooves under the action of capillary force. SWCNTs / PEDOT:PSS / Fe 2 o 3 The slurry was filled into the groove on the other side, and repeated 5 times for self-assembly of the negative electrode interdigitated film. After ...

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Abstract

The invention relates to an asymmetric microchip supercapacitor and a preparation method thereof, comprising: adding positive and negative electrode slurries with ink properties into grooves on both sides of a PDMS template respectively, and realizing asymmetric microchip electrodes under the action of capillary force self-assembly of ; using PAM / Na 2 SO 4 The gel is used as the electrolyte to complete the device assembly. The ink-like electrode paste can be easily manipulated during the assembly of microchip devices and can form a very uniform electrode film. Asymmetric microchip devices have better flexibility and bending resistance than traditional sandwich-structured devices. It has certain guiding significance for the low-cost and large-scale fabrication of asymmetric microchip devices.

Description

technical field [0001] The invention belongs to the field of microchip supercapacitor materials and preparation thereof, in particular to an asymmetric microchip supercapacitor and a preparation method thereof. Background technique [0002] In recent years, miniaturization, portability, high integration and even flexibility and wearable have become the main development trend of electronic products. Therefore, there is an urgent need for a miniaturized and flexible energy storage device as its energy supply unit. However, supercapacitors with a traditional sandwich structure usually have a large volume and are very bulky in applications such as chip integration. Different from traditional supercapacitors, microchip supercapacitors have broad application prospects in the integration of MEMS. First of all, the positive and negative electrodes of the device are in the same plane, no diaphragm is required, the device structure is simplified, and the thickness of the device can a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G11/10H01G11/30H01G11/84
CPCH01G11/10H01G11/30H01G11/84Y02E60/13
Inventor 王宏志李建民李耀刚张青红侯成义
Owner DONGHUA UNIV
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