A nanosecond laser machining method for ceramic surface holes based on machining trajectory optimization

Abstract

The invention relates to a nanosecond laser processing method for ceramic surface holes based on processing trajectory optimization. The method includes: S1: building a nanosecond laser processing system; S2: cutting and cleaning aluminum nitride ceramic sheets; S3: setting nanosecond Adjustment parameters of the laser processing system; S4: Set the processing method and laser trajectory parameters for the primary processing; S5: Perform primary processing on the aluminum nitride ceramic sheet to form primary surface holes S6: Set the processing method and laser trajectory for the secondary processing Parameter; S7: Perform secondary processing on the aluminum nitride ceramic sheet, and let it stand for cooling. Compared with the prior art, the present invention processes the aluminum nitride ceramic sheet twice through primary processing and secondary processing, so that the entrance and exit apertures, hole taper, entrance and exit morphology and side wall morphology of the aluminum nitride surface holes are It is improved, and the present invention is easy to operate, and the processing can be completed by using a common nanosecond laser processing system without additional equipment and operations, and the processing effect is good.

Description

technical field [0001] The invention relates to a method for processing ceramic surface holes, in particular to a nanosecond laser processing method for ceramic surface holes based on processing trajectory optimization. Background technique [0002] Aluminum nitride has various properties at room temperature and is widely used in industry. For example, based on its high resistivity, dielectric strength, thermal conductivity and low thermal expansion coefficient and dielectric constant, it can be used for insulating substrates of high-power semiconductor devices and heat dissipation substrates and packaging substrates for large-scale and ultra-large-scale integrated circuits. Based on its high acoustic wave conduction velocity, it can be used for surface wave devices in high-frequency information processors; based on its high fire resistance and high temperature chemical stability, it can be used to make crucibles working at 1400-2000°. Among them, aluminum nitride is most w...

AI Technical Summary

Problems solved by technology

For holes with large diameter requirements, trajectory scanning processing is often the first choice, but during the processing process, the hole body is tapered, so that part of the laser beam is refracted by the side wall slope and part of the laser energy is lost, resulting in poor roundness of the hole exit. The exit aperture is significantly smaller than the entrance aperture

Secondly, when the trajectory scanning process is used, the contact area between the laser and the material is large, and the thermal impact is also very serious. The specific performance is that a large amount of spatter is generated at the processing hole, and the side wall of the hole is seriously peeled off and other defects.

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