Vacuum temperature field measurement device and method
A measurement device and temperature field technology, applied in the field of thermal imaging, can solve the problems of inability to meet the requirements of temperature measurement accuracy and the inability to realize contact temperature measurement, and achieve the effect of improving measurement accuracy
Active Publication Date: 2020-03-27
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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However, for some specific applications, such as the field of extreme ultraviolet lithography vacuum temperature field measurement, the use of contact temperature measurement systems cannot achieve contact temperature measurement of all areas of interest, and the surface measurement accuracy of infrared thermal imaging cameras cannot meet the temperature measurement accuracy. Require
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[0047]In order to make the purpose, features, and advantages of the application more obvious and understandable, the technical solutions in the embodiments of the application will be clearly and completely described below in conjunction with the drawings in the embodiments of the application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.
[0048] see figure 1 , figure 1 A schematic structural diagram of a vacuum temperature field measurement device provided in an embodiment of the present application, the device mainly includes:
[0049] Measurement reference 1, vacuum wire 2, vacuum chamber 3, contact temperature measurement element 4, contact temperature measurement signal processing module 5, infrared therma...
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The invention discloses a vacuum temperature field measurement device. The device is applied to the technical field of thermal imaging, and is characterized in that a measurement reference is arrangedon a measured object, a contact type temperature measurement element is connected with the measurement reference, and a vacuum wire penetrates through a vacuum cavity to be connected with a contact type temperature measurement signal processing module, so that the contact type temperature measurement signal processing module obtains a nominal temperature value of the measurement reference; an infrared window is formed in one cavity wall of the vacuum cavity, an infrared thermal imager measures the actual measurement temperature value of the temperature measurement reference and the actual measurement temperature value of each pixel on the surface of the measured object through the infrared window, and a data processing module obtains the two-dimensional temperature field of the measured object according to the nominal temperature value of the measurement reference, the actual measurement temperature value, and the actual measurement temperature value of each pixel on the surface of the measured object. The invention also discloses a vacuum temperature field measurement method, which not only can realize the vacuum mid-plane measurement, but also can improve the measurement precision of the temperature field.
Description
technical field [0001] The present application relates to the technical field of thermal imaging, in particular to a vacuum temperature field measuring device and method. Background technique [0002] The temperature measurement generally adopts the contact measurement method, which has the advantage of high temperature measurement accuracy. The disadvantage of the contact temperature measurement system is that it can only measure the point of the measured object. For some specific use occasions, it is necessary to measure the temperature surface of the measured object, which requires the use of infrared thermal imaging cameras. During the use of infrared thermal imaging cameras, its accuracy is affected by multiple error sources such as shooting angle, shooting distance, object surface emissivity, and internal stray light. [0003] The contact temperature measurement system can realize high-precision temperature point measurement, and the infrared thermal imager can reali...
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IPC IPC(8): G01J5/00G01K1/14G01K7/18
CPCG01J5/00G01K7/18G01K1/14G01J2005/0077G01J5/485G01J5/80
Inventor 陈进新齐威李璟齐月静杨光华折昌美
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI