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Method for manufacturing multilayer printed wiring board and multilayer printed wiring board

A multi-layer printing and manufacturing method technology, applied in the manufacture of multi-layer printed wiring boards and the field of multi-layer printed wiring boards, can solve the problems of adhesive layer thickness variation, hindering printed wiring boards, uneven thickness, etc.

Inactive Publication Date: 2020-04-03
THE FUJIKURA CABLE WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Impedance changes according to the distance between the signal line and the adjacent conductive layer, so there is a problem that the change in the thickness of the adhesive layer and the unevenness of the thickness hinder the manufacture of the printed wiring board with the impedance characteristics as originally designed.

Method used

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  • Method for manufacturing multilayer printed wiring board and multilayer printed wiring board
  • Method for manufacturing multilayer printed wiring board and multilayer printed wiring board
  • Method for manufacturing multilayer printed wiring board and multilayer printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0025] Hereinafter, the manufacturing method of the multilayer printed wiring board which concerns on 1st Embodiment of this invention is demonstrated based on drawing. The multilayer printed wiring board obtained by the manufacturing method of this embodiment has a multilayer structure and has high bendability.

[0026] Figure 1A A cross-sectional view showing a semi-finished product 1 of a multilayer printed wiring board obtained in the course of the manufacturing method of the present embodiment. Figure 1A The semi-finished product 1 shown is the semi-finished product in the state before the cutting process after the thermocompression bonding process (after the lamination process) and before the cutting process in the manufacturing process of the multilayer printed wiring board 10 . Will Figure 1A The semi-finished product 1 shown is cut out at least along the finished part Q of X1 and X2, and the multilayer printed wiring board 10 as a finished product is obtained. The ...

no. 2 Embodiment approach ＞

[0059] Below, based on Figure 3A ~ Figure 3C , The method of manufacturing the multilayer printed wiring board according to the second embodiment of the present invention will be described. Figure 3A The multilayer printed wiring board 10' of this embodiment is shown. Figure 3B It is a plan view showing an arrangement example of spacers in the second embodiment. Figure 3C A sectional view showing a semi-finished product 1' of a multilayer printed wiring board obtained in the course of the manufacturing method of this embodiment. The semi-finished product 1' of the multilayer printed wiring board of this embodiment, and the multilayer printed wiring board 10' obtained from the semi-finished product 1' have a multilayer structure and have high flexibility. If the multilayer printed wiring board 10' corresponding to the finished product part Q5 of the semifinished product 1' of the multilayer printed wiring board manufactured by the manufacturing method of the second embodi...

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Abstract

The present invention discloses a method for manufacturing a multilayer printed wiring board, and the method comprises a step for preparing a first wiring board (L1) in which signal lines (121, 122) are formed on the principal surface of a first insulating substrate (11), and a second wiring board (L2) in which a second electrically conductive layer (15) is formed on the principal surface of a second insulating substrate (14), the second wiring board (L2) being laminated on the first wiring board (L1); a step for placing spacers (21) of a designated thickness at positions set at a designated distance apart from the outer edge of a circuit region (12A) along at least a portion of the outer edge; a step for forming an adhesion layer (20) in the circuit region (12A) with spaces (22) providedbetween the adhesion layer (20) and the spacers (21); and a step for thermocompressively bonding the first wiring board (L1) and the second wiring board (L2) with the adhesion layer (20) interposed therebetween. The designated distance is the distance in which, after the thermocompression bonding step, space is formed between the adhesion layer (20) and the spacers (21).

Description

technical field [0001] The present invention relates to a method for manufacturing a multilayer printed wiring board and a multilayer printed wiring board. Background technique [0002] From the viewpoint of controlling the impedance of the transmission line, there is known a printed wiring board with a microstrip structure in which an insulating resin layer embedded in a ground layer and an insulating resin layer embedded in a signal line are laminated with an adhesive layer interposed therebetween. (Patent Document 1). [0003] Patent Document 1: Japanese Patent No. 4943247 [0004] However, in the manufacturing process of a printed wiring board with a multilayer structure, if interlayer bonding is performed by thermocompression bonding with an adhesive layer interposed, the adhesive layer melts, and the melted adhesive enters the signal line. The gap of the circuit and therefore the thickness of the adhesive layer changes from the initial state. In addition, when press...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4611H05K2201/2036H05K2201/0191H05K1/024H05K1/025H05K1/0219H05K2201/09236H05K2201/09336H05K2203/061H05K2203/1105H05K1/0298
Inventor 山崎昭实
Owner THE FUJIKURA CABLE WORKS LTD