Lead frame of novel SMD packaging structure
A technology of lead frame and packaging structure, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of low density, low output, poor lead frame precision, etc., to promote update iteration, improve processing level, and manufacturing cycle shortened effect
Pending Publication Date: 2020-04-07
广东先捷电子股份有限公司
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Problems solved by technology
[0006] The purpose of this invention patent is to overcome the poor precision of the lead frame, low density, low output, lack of refinement of the outer pins of the chip components in the manufacturing process of the existing similar products, and the outer pins are too long and too wide. , too thick and other defects and deficiencies, and provide the society with a microelectronic package that conforms to the standardization of design molds, high production efficiency and raw material utilization, good product packaging quality, long service life, and develops in the direction of high precision, high density, and high output. lead frame
Method used
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Embodiment Construction
[0018] The present invention will be further explained in detail below in conjunction with the examples, and the examples are only for explanation and are not intended to limit the present invention.
[0019] Such as Figure 1 to Figure 2 As shown, the embodiment of the present invention provides a lead frame of a novel SMD packaging structure, the lead frame as a whole includes a core-carrying structural unit 101, pins 102, mechanical positioning holes 103, load-bearing ribs 104 and transverse ribs 105; An L-shaped first base island 106 and an inverted L-shaped second base island 107 are distributed on the core-carrying structural unit 101. The L-shaped first base island 106 and the inverted L-shaped second base island 107 are in complementary engagement. The first base island 106 and the ends of the second base island 107 are respectively connected to the pins 102, the load-bearing ribs 104, the core-carrying structural unit 101, and the pins 102 are arranged in the same hor...
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Abstract
The invention provides a lead frame of a novel SMD packaging structure, and the lead frame is characterized in that the whole lead frame comprises a carrier core structure unit, pins, mechanical positioning holes, bearing ribs and transverse connecting ribs; l-shaped first base islands and inverted-L-shaped second base islands are distributed on the carrier core structure units, and the first baseislands and the second base islands are meshed in a complementary mode; a traditional single-row array type is improved into a multi-row array type lead frame. The lead frame can meet and be compatible with the requirements of high reliability, miniaturization and convenience of packaging and manufacturing of microelectronic products; the packaging processing level of the semiconductor industry is improved, updating iteration of packaging equipment is promoted, and the surface-mounted component has the multifunctional characteristic; the lead frame has high standardization, high reliability,high precision, high density, high yield and multiple functions, and the manufacturing period is greatly shortened.
Description
technical field [0001] The invention relates to the technical field of manufacturing semiconductor electronic components, in particular to a lead frame of a novel SMD packaging structure. Background technique [0002] Semiconductor integrated circuit components are called "industrial rice", but in general, what users need is not only a fully functional bare chip, but also a lead frame that undertakes protection and carrier. The lead frame has mechanical support, electrical connection , physical protection, external field shielding, stress relaxation, heat dissipation and moisture resistance, size transition, normalization and standardization and other multiple functions; it is a key to realize the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding wire to form an electrical circuit Structural parts, which act as a bridge to connect with external wires, lead frames are required in most semiconductor chips,...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/495H01L21/48
CPCH01L21/4828H01L23/49513H01L23/49541H01L2224/97
Inventor 吴育洪郑晓颖郑思海
Owner 广东先捷电子股份有限公司