Blind hole machining rotary cutting system and blind hole machining method

A processing method, blind hole technology, applied in metal processing equipment, manufacturing tools, welding/welding/cutting items, etc., can solve the problems of high cost of rotary cutting equipment, large blind hole taper, etc., to improve quality and avoid blind holes Taper, cost reduction effect

Active Publication Date: 2022-03-15
WUHAN HGLASER ENG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The purpose of the present invention is to provide a blind hole processing rotary cutting system and a blind hole processing method to solve the problems in the prior art that the blind hole taper of the non-transparent and brittle material processing is relatively large and the processing rotary cutting equipment is expensive. technical issues

Method used

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  • Blind hole machining rotary cutting system and blind hole machining method
  • Blind hole machining rotary cutting system and blind hole machining method
  • Blind hole machining rotary cutting system and blind hole machining method

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Embodiment

[0055] Please refer to figure 1 , this embodiment provides a blind hole processing rotary cutting system, figure 1 Schematic diagram of the structure of the rotary cutting system for blind hole processing provided by the embodiment of the present invention; figure 2 The magnified effect diagram of the blind hole processed by the blind hole processing rotary cutting system provided for the embodiment of the present invention, from left to right is the blind hole effect diagram enlarged by 50 times, the blind hole edge effect diagram enlarged by 225 times, and the blind hole edge effect diagram enlarged by 225 times Blind hole corner renderings. Figure 3-Figure 5 The 3D microscope measurement results of the blind holes processed by the blind hole processing rotary cutting system provided for the embodiments of the present invention.

[0056] The blind hole processing rotary cutting system provided in this embodiment is an ultra-fast laser drilling processing equipment, which...

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Abstract

A blind hole processing rotary cutting system and a blind hole processing method relate to the field of machining. The blind hole processing rotary cutting system includes a laser, a beam expander, a polarization device, a return mirror, an angle adjustment device and a working platform for loading the product to be processed; the laser light of the laser can pass through the beam expander, the polarization device, the return mirror and The angle adjustment device is used to irradiate on the working platform; the polarization device is used to change the linearly polarized light of the laser into circularly polarized light or radially polarized light; the folding mirror can change the laser propagation direction; the angle adjusting device can change the laser irradiation on the working platform Angle. The blind hole processing method is suitable for the blind hole processing rotary cutting system. The purpose of the present invention is to provide a blind hole processing rotary cutting system and a blind hole processing method to solve the problems in the prior art that the blind hole taper of the non-transparent and brittle material processing is relatively large and the processing rotary cutting equipment is expensive. technical issues.

Description

technical field [0001] The invention relates to the field of machining, in particular to a blind hole machining rotary cutting system and a blind hole machining method. Background technique [0002] Ceramics, especially non-transparent and brittle ceramics, are formed by sintering; the formed ceramics have many excellent properties in electricity, magnetism, sound, light, heat, etc., which are difficult for other materials to match. Therefore, it is widely used in energy development, electronic technology, sensing technology, laser technology, optoelectronic technology, infrared technology, biotechnology, environmental science and so on. [0003] Due to the wide range of ceramic applications, the simple sintering process can no longer meet the rich and colorful needs in terms of shape and structure; however, 3D printing is time-consuming and costly, and the physical properties of ceramic materials are relatively brittle, and mechanical processing is subject to certain restri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/402B23K26/386B23K26/064B23K26/142
CPCB23K26/402B23K26/386B23K26/064B23K26/0643B23K26/142B23K2103/52
Inventor 王玉莹王雪辉刘彪杨立昆刘勇
Owner WUHAN HGLASER ENG CO LTD
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