A soaking plate type cooling device

Abstract

The invention discloses a soaking plate type heat dissipation device, which comprises a heat conductor and a fan. The heat conductor is provided with an air duct; the heat conductor includes an evaporation plate, a steam pipe, a return pipe, a condensation plate and a side plate, and the evaporation plate contacts a heat source to absorb The heat of the heat source, the evaporating plate and the condensing plate are hollow structures, and the two ends of the steam pipe and the return pipe are respectively connected and communicated with the evaporating plate and the condensing plate to form a sealed space; the steam pipe is arranged in the middle of the evaporating plate and the condensing plate, The return pipe is set at the head and end of the middle part of the evaporating plate and the condensing plate; the sealed space is in a vacuum state and filled with a liquid working medium. After the evaporating plate absorbs heat, the liquid working medium vaporizes and flows into the steam pipe-condensing plate- The return pipe-evaporation plate forms a heat absorption-radiation circulation loop; the entire sealed space of the present invention is a heat conduction structure, which greatly increases the heat dissipation area to quickly achieve the purpose of heat absorption and heat dissipation, and has high thermal conductivity and efficiency.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a vapor chamber type heat dissipation device. Background technique [0002] With the rise of new energy vehicles, the promotion of LEDs in the lighting market, the miniaturization of digital products such as computers, and the use of compact chips, the power density of electronic products is becoming higher and higher. The technical requirements have been greatly improved, and heat dissipation technology has become an important factor restricting product development. At present, most electronic and electrical equipment on the market mainly use axial flow fans, cooling fins, and heat pipes for air convection heat dissipation. 2 The electronic equipment heat dissipation system can play a very good heat dissipation effect, but when the heat flux density of electronic equipment is large, for example, it is between 1 ~ 10W / cm 2 Within the range, the heat absorption and heat dissipation e...

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Problems solved by technology

At present, most electronic and electrical equipment on the market mainly use axial flow fans, cooling fins, and heat pipes for air convection heat dissipation. 2 The electronic equipment heat dissipation system can play a very good heat dissipation effect, but when the heat flux density of electronic equipment is relatively large, for example, it is between 1 and 10W / cm 2 Within the range, the heat absorption and heat dissipation effect of the axial flow fan combined with the heat dissipation fins and heat pipes for air convection heat dissipation cannot meet the needs of electronic equipment with high heat flux density, resulting in the problem that electronic equipment is prone to poor operation

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