Method for preparing carbon fiber heat insulation hard felt by taking water-soluble phenolic resin as curing agent

Abstract

The invention provides a method for preparing carbon fiber heat insulation hard felt by taking water-soluble phenolic resin as a curing agent. The method comprises the steps that firstly, carbon fibersoft felt is introduced into a dipping tank storing the water-soluble phenolic resin to be subjected to dipping treatment, redundant dipping liquid is extruded out through extruding wheels after dipping is completed, then the carbon fiber soft felt is introduced into a low-temperature drying oven to be subjected to dewatering treatment, and after dewatering treatment is completed, carbon fiber prepreg soft felt is obtained; secondly, the carbon fiber prepreg soft felt is put in a mold and changed into a carbon fiber hard felt blank through hot-pressing curing treatment in a hot pressing machine; and thirdly, the carbon fiber hard felt blank is sintered in a vacuum high-temperature furnace, and the graphitized carbon fiber heat insulation hard felt is obtained. According to the method, thewater-soluble phenolic resin is adopted to replace a phenolic resin organic solvent solution to serve as the curing agent, multiple technological steps and technological parameters are adaptively changed, and finally the problems that when a traditional organic solvent is used, environmental pollution is serious, safety dangerousness is high, occupational injuries are serious, transportation andstorage are difficult, and the cost is high are avoided.

Description

technical field [0001] The invention relates to the technical field of carbon fiber thermal insulation materials, in particular to a method for preparing carbon fiber thermal insulation hard felt with water-soluble phenolic resin as a curing agent. Background technique [0002] Carbon fiber insulation materials (such as carbon fiber insulation hard felt) have excellent properties such as small thermal conductivity, low heat capacity, small linear expansion coefficient, constant mechanical strength at high temperatures, corrosion resistance, and light weight. They can be used in high-temperature vacuum furnaces or inert atmosphere furnaces. It has been widely used, especially in recent years, in high-end technology fields such as semiconductors, sapphires, optical fibers, and LEDs. It has also shown good prospects for use, and it has increasingly shown its vitality as a new material. [0003] A solution of phenolic resin dissolved in an organic solvent (such as acetone, alcoh...

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Problems solved by technology

[0004] At present, domestic enterprises generally use the organic solvent solution of phenolic resin as a curing agent to manufacture carbon fiber insulation materials. Although the above-mentioned organic solvents such as acetone and alcohol are easy to infiltrate, easy to volatilize in the thermal curing process, and have strong adaptability to phenolic resin, etc., However, there are also a series of problems such as high risk (easy to cause fire), serious environmental pollution (VOC emission), harmful to human body, strict transportation and storage requirements (hazardous chemicals), and high cost.