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Plating Chuck

A chuck and electric field technology, applied in circuits, electrolytic components, electrolytic processes, etc., can solve the problems of high plating column height and excessive electroplating, and achieve the effect of reducing the thickness of the plating layer and improving the uniformity

Active Publication Date: 2022-05-13
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While the notch area cannot be plated is not a problem for the notch area, the problem is that the lack of plating in the notch area can cause the pattern area adjacent to the notch area to be over-plated, and finally the plated pillar height of the pattern area adjacent to the notch area is higher than the target value

Method used

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Embodiment Construction

[0041] The present invention proposes a substrate holding device for holding a substrate during substrate processing, for example, immersion of the substrate in an electrolytic solution for electroplating. When the substrate is immersed in an electrolyte to plate a metal layer on the front side of the substrate, the edges of the front side of the substrate and the back side of the substrate need to be protected from contact with the electrolyte. Therefore, the difference from the prior art is that when the substrate is submerged in the electrolytic solution for electroplating, the substrate holding device of the present invention utilizes a seal to prevent the electrolyte from contacting the edge of the front side of the substrate and the back side of the substrate, and the seal is replaceable .

[0042] refer to Figure 1 to Figure 6 Shown is the substrate holding device 100 of the present invention. The substrate holding device 100 includes a cup chuck 101 and a chuck plat...

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Abstract

The present invention discloses an electroplating chuck for holding a substrate during an electroplating process. The substrate includes a notch area (3031) and a pattern area (3032) adjacent to the notch area (3031). The electroplating chuck includes a cover plate (3033) configured to cover the notch area (3031) of the substrate and shield the electric field of the notch area (3031) when the substrate is electroplated.

Description

technical field [0001] The present invention relates to an electroplating device for depositing a metal thin film on a substrate, and more particularly, to an electroplating chuck for holding a substrate during an electroplating process, which can improve the uniformity of the plating layer near the notch area on the substrate. Background technique [0002] Electroplating is a commonly used method for depositing metal thin films on substrates during semiconductor device manufacturing. In particular, in advanced packaging technology, electroplating is usually used to form copper pillars and solder joints on the substrate to realize chip substrate interconnection. The reason is that electroplating has the advantages of simple process, low cost, and easy mass production. [0003] In mass production of wafer-level packaging, the product substrate is supplied with a notched area at its edge. The notch area is covered with photoresist, so the notch area is not conductive, so it c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/12
CPCC25D17/008C25D17/001H01L2224/94H01L24/94H01L24/742H01L2224/11462H01L24/11H01L24/13H01L24/14H01L2224/131H01L2224/13147H01L2224/11H01L2924/00012H01L2924/014H01L2924/00014C25D17/004C25D17/08H01L21/6732H01L21/67326H01L21/687H01L21/288H01L21/2885H01L21/28562H01L21/445H01L21/479
Inventor 王晖王坚贾照伟杨宏超
Owner ACM RES SHANGHAI