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Circuit board with sandwich metal radiator

A metal heat sink, circuit board technology, applied in the direction of circuits, printed circuits, printed circuits, etc., to achieve the effects of flexible wiring, good thermal conductivity, and good electrical insulation performance

Inactive Publication Date: 2020-04-21
RAYBEN TECH ZHUHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the circuit board can only install power devices on one side, which is more limited in application

Method used

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  • Circuit board with sandwich metal radiator
  • Circuit board with sandwich metal radiator
  • Circuit board with sandwich metal radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] see figure 1 , the circuit board of embodiment 1, the radiator has a metal heat dissipation plate 11 and metal heat conduction bosses 12 formed on two opposite surfaces of the metal heat dissipation plate 11; wherein the gold heat dissipation plate 11 is preferably a copper heat dissipation plate, and the metal heat conduction boss 112 is the The heat conduction copper boss integrally connected with the copper cooling plate. The height of the metal heat conducting boss 12 is 0.1 mm to 1 mm, preferably 0.1 mm to 0.5 mm. Wherein, the height and / or shape of the metal heat conduction bosses 112 on two opposite surfaces of the metal heat dissipation plate 11 may be the same or different.

[0031] A first insulating hole 111 is disposed in the metal heat dissipation plate 111 , and the insulating resin 13 is filled in the first insulating hole 111 . The two opposite surface sides of the metal heat dissipation plate 11 are provided with insulating substrates, and the insulat...

Embodiment 2

[0036] see figure 2 The only difference between Embodiment 2 and Embodiment 1 is that the insulating substrate 20 is a single-layer structure. For example, the insulating substrate 20 is an adhesive insulating resin layer, and is pressure-bonded and adhesively fixed to the surface of the metal heat dissipation plate 11 .

Embodiment 3

[0038] see image 3 , the difference between Embodiment 3 and Embodiment 1 is that: the conductive vias and the conductive pads 302 are formed at different positions of the circuit board, and the solder resist film 50 covers the conductive vias; correspondingly, the patterned metal layer may only include the The copper foil layer 31 on the insulating substrate, and the copper clad layer 32 covering the copper foil layer 31 and the metal heat conducting boss 12 .

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Abstract

The embodiment of the invention discloses a circuit board with a sandwich metal radiator. The circuit board comprises a metal radiator, insulating substrates, conductive circuits, and device heat conduction bonding pads; the metal radiator is provided with a metal heat dissipation plate and metal heat conduction bosses formed on two opposite surfaces of the metal heat dissipation plate; the insulating substrates are arranged on two opposite surfaces of the metal heat dissipation plate; the conductive circuits are formed on the surfaces of the insulating substrates; the conductive circuits located on the two opposite surface sides of the circuit board are electrically connected through conductive via holes; the conductive via holes penetrate through the insulating substrates and the metal heat dissipation plate; the device heat conduction bonding pads are formed on two opposite surfaces of the circuit board and are directly connected with the heat conduction bosses; first insulating holes for the conductive via holes to pass through are formed in the metal heat dissipation plate; the first insulating holes are filled with an insulating medium for electrically insulating the conductive via holes and the metal heat dissipation plate; second insulating holes for the conductive via holes to pass through are formed in the insulating substrates; and the diameter of the second insulating holes is smaller than that of the first insulating holes. The circuit board provided by the invention has the advantages of good electric insulation capability and heat dissipation capability.

Description

technical field [0001] The invention relates to the field of printed circuit boards; more specifically, it relates to a circuit board with a sandwich metal radiator. Background technique [0002] Power semiconductor devices such as LEDs (light emitting diodes), MOSFETs (electrical field effect transistors) and IGBTs (insulated gate bipolar transistors) usually use circuit boards as mounting boards. Because power semiconductor devices generate a lot of heat when they are working, so It is required that the circuit board on which it is mounted has good thermal conductivity. [0003] Chinese patent application CN201110032105.1 discloses a double-layer high heat dissipation sandwich metal-based printed circuit board, which is provided with a copper-based or aluminum-based heat dissipation plate at the core of the insulating substrate to form a "sandwich" type sandwich metal circuit board. In order to enhance the heat dissipation performance of the circuit board by using the cop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H01L23/367
CPCH01L23/367H01L23/3677H05K1/0203H05K1/0204H05K1/0207H05K1/0256H05K1/113H05K1/115H05K1/116H05K2201/06H05K2201/0753
Inventor 袁绪彬黄广新陈爱兵高卫东
Owner RAYBEN TECH ZHUHAI