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Huge transfer carrier plate, huge transfer device and huge transfer method

A technology of transfer device and transfer method, applied in the field of mass transfer, can solve the problems of difficult adjustment of micro-device spacing and small size, etc.

Active Publication Date: 2020-04-21
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, the spacing of micro-devices is usually adjusted according to needs. Due to the large number of micro-devices and small size, there is a problem that the spacing of micro-devices is difficult to adjust

Method used

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  • Huge transfer carrier plate, huge transfer device and huge transfer method
  • Huge transfer carrier plate, huge transfer device and huge transfer method
  • Huge transfer carrier plate, huge transfer device and huge transfer method

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Embodiment Construction

[0036] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Please also see Figure 1-Figure 6 , the present invention provides some embodiments of a mass transfer carrier.

[0038] Such as figure 1 As shown, a carrier plate 10 for mass transfer of the present invention includes: a temperature control device 11, a telescopic plate 12 located on the temperature control device 11, and a first adhesive layer 13 disposed on the telescopic plate 12 The temperature control device 11 is used to control the temperature of the telescopic plate 12, and the telescopic plate 12 is used to expand and contract according to temperature changes, so as t...

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Abstract

The invention discloses a huge transfer carrier plate, a huge transfer device and a huge transfer method. The huge transfer carrier plate comprises a temperature control device, a telescopic plate located on the temperature control device and a first adhesive layer arranged on the telescopic plate. The temperature control device is used for controlling the temperature of the telescopic plate, andthe telescopic plate is used for stretching out and drawing back according to temperature changes so as to adjust the distance between the micro devices attached to the first adhesive layer. In the mass transfer process; the micro device is adhered to the telescopic plate through the first adhesive layer; when the distance between the micro devices needs to be adjusted, the temperature of the telescopic plate can be adjusted through the temperature control device, the telescopic plate can be stretched or contracted under the influence of temperature changes, and therefore the distance betweenthe micro devices adhering to the telescopic plate is driven to be increased or decreased, and the distance between the micro devices is adjusted in the further large-scale transferring process.

Description

technical field [0001] The invention relates to the technical field of mass transfer, in particular to a carrier plate for mass transfer, a mass transfer device and a method thereof. Background technique [0002] Micro-device technology refers to an array of micro-sized components integrated at high density on a driver circuit board. At present, micro-pitch light-emitting diode (Micro-LED) technology has gradually become a research hotspot. Micro-LED technology, that is, LED miniaturization and matrix technology, has good stability, lifespan, and advantages in operating temperature. It also inherits the LED has the advantages of low power consumption, color saturation, fast response, strong contrast, etc. Micro-LED has higher brightness and lower power consumption. [0003] In the prior art, the pitch of the micro-device is usually adjusted according to the needs. Due to the large number and small size of the micro-device, it is difficult to adjust the pitch of the micro-de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/677
CPCH01L21/67706H01L21/6773H01L21/67736H01L21/6835H01L2221/68368H01L2221/68381
Inventor 钟光韦伍凯义杨然翔江仁杰沈佳辉
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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