Laser cutting device capable of forming extendable controllable crack based on plasma and laser cutting method

Abstract

The invention discloses a laser cutting device capable of forming an extendable controllable crack based on plasma and laser cutting method. The laser cutting device comprises a multi-axis mobile platform (9), an imaging system, an invisible cutting device and one or more auxiliary laser devices, wherein the imaging system is used for acquiring a surface image of a to-be-machined workpiece (14) onthe multi-axis mobile platform (9), the invisible cutting device is used for generating a laser beam (15), the laser beam (15) converges into the to-be-machined workpiece (14) to make a workpiece material at an invisible cutting laser focal spot (13) be gasified and ionized to form the plasma, and the plasma expands and impacts the material to form the crack, the one or more auxiliary laser devices are used for generating an auxiliary laser beam (16), and the focal spot of the auxiliary laser beam (16) converges to a plasma and crack area inside the to-be-machined workpiece (14) to accelerateexpansion of the plasma to further impact the formed crack to make the crack be extended. According to the device and the method, by controlling the position and the energy of the auxiliary laser beam (16), the crack extension length and direction are controllable.

Description

technical field [0001] The invention belongs to the field of mechanical cutting and processing, and relates to a high-definition ultrafast laser stealth cutting technology, in particular to a plasma-based laser cutting device and method for extending controllable cracks. Background technique [0002] At present, the semiconductor industry widely uses mechanical dicing methods to cut wafers. Wafer mechanical dicing is the use of high-speed rotating cutting blades to directly divide the wafer. The advantage of mechanical cutting is that it is easy to operate and does not require high cutting equipment. However, mechanical cutting has many disadvantages. Firstly, mechanical dicing can easily cause chipping and breakage of the wafer; secondly, the scribing line of mechanical dicing is relatively large, causing unnecessary waste; finally, the blades used in mechanical dicing are easy to wear and need to be replaced frequently, resulting in high cost. Ultimately, these disadvan...

AI Technical Summary

Problems solved by technology

However, as the demand for chips increases, the efficiency of laser stealth dicing cannot meet the relevant requirements. Therefore, improving the efficiency of laser stealth dicing is an urgent problem to be solved in the semiconductor industry

[0005] Generally speaking, the semiconductor industry improves the processing efficiency by increasing the laser energy to form a larger modified layer to reduce the number of stealth cuts, but this leads to the expansion of the damaged area inside the wafer

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