Laser cutting device capable of forming extendable controllable crack based on plasma and laser cutting method
A laser cutting and plasma technology, used in laser welding equipment, semiconductor devices, manufacturing tools, etc., can solve problems such as the inability of laser stealth cutting efficiency to meet relevant requirements and the expansion of wafer damage areas, so as to improve production efficiency and production quality. , The effect of improving cutting efficiency and improving flatness
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[0046] The plasma-based laser cutting device for controllable crack expansion includes: a multi-axis moving platform 9; an imaging system for acquiring surface images of the workpiece 14 on the multi-axis moving platform 9; an invisible cutting device for generating a laser beam 15, laser The beam 15 converges to the inside of the workpiece 14 to be processed to form a high-energy stealth cutting laser focal spot 13, where the workpiece material absorbs energy and vaporizes and ionizes to form plasma, which expands and impacts the material to form cracks; and one or more Auxiliary laser device is used to generate auxiliary laser beam 16, the focal point of auxiliary laser beam 16 is converged to the plasma and crack area inside processing workpiece 14. The plasma absorbs the energy of auxiliary laser beam 16 and then accelerates and expands, and further impacts the formed cracks, causing cracks Extension. Since the cracks are longer than the cracks obtained by the unmodified st...
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