Unlock instant, AI-driven research and patent intelligence for your innovation.

Packaging structure and preparation method thereof

A packaging structure and adhesive layer technology, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, can solve the problems of easy peeling of inorganic and organic film layers, and achieve enhanced adhesion, enhanced bonding strength, Effect of improving luminous efficiency

Inactive Publication Date: 2020-05-05
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The application provides a packaging structure and its preparation method to solve the technical problem of easy peeling between inorganic and organic film layers, thereby improving the luminous efficiency of OLED devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging structure and preparation method thereof
  • Packaging structure and preparation method thereof
  • Packaging structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0065] The application provides a method for preparing a packaging structure, which includes the following steps:

[0066] Step S201: forming a first inorganic layer 101;

[0067] Step S202: Coating or spraying a first modifier on the first inorganic layer 101, the first modifier and the first inorganic layer 101 form a first bonding layer 1011 through a first chemical bond;

[0068] Step S203: removing the first modifier;

[0069] Step S204: forming an organic layer 102 on the first adhesive layer 1011;

[0070] Step S205 : forming the second inorganic layer 103 on the organic layer 102 and the exposed first inorganic layer 101 .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a packaging structure and a preparation method thereof. The packaging structure comprises a first inorganic layer, an organic layer and a second inorganic layer, wherein the organic layer is arranged on the first inorganic layer; the second inorganic layer is arranged on the organic layer; the first inorganic layer comprises a first bonding layer; and the first bonding layeris formed by combining a first modifier and a part of the first inorganic layer through a first chemical bond, the first bonding layer is arranged on one side, close to the organic layer, of the first inorganic layer, and the first bonding layer is bonded with the organic layer. Under the condition that no film layer is added, the bonding strength between the inorganic film layer and the organicfilm layer is enhanced, so that stripping between the film layers is prevented, and the light-emitting efficiency of the OLED device is improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a package structure and a preparation method thereof. Background technique [0002] At present, OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display panels have the advantages of light weight, wide viewing angle, fast response time, low temperature resistance and high luminous efficiency compared with traditional liquid crystal displays. The next generation of new display technology. [0003] In the encapsulation technology of OLED devices, the encapsulation layer often adopts an inorganic / organic / inorganic overlapping film structure, in which the inorganic film layer acts as a water and oxygen barrier layer to prevent the intrusion of external water vapor and oxygen, while the organic film layer acts as a buffer layer , can be used to slow release the stress in the inorganic film layer, thereby enhancing the flexibility of the OLED device. Howev...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32
CPCH10K59/10H10K50/844H10K71/00
Inventor 孙佳佳
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD