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Tin surface protective agent and preparation method thereof

A technology of protective agent and mixture, applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, electrical components, etc.

Inactive Publication Date: 2020-05-08
深圳市星扬高新科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high cost of metal tin and the inability of the existing technology to minimize the thickness of tin, it has caused great pressure on the production and processing costs of enterprises

Method used

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  • Tin surface protective agent and preparation method thereof
  • Tin surface protective agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] S1. Mix and stir 0.5kg of monoethanolamine and 44kg of water until monoethanolamine is completely dissolved to obtain a primary mixture;

[0023] S2. Add 1.0 kg polyethylene glycol 300 into the primary mixture and mix and stir until the polyethylene glycol 300 is completely dissolved to obtain the secondary mixture;

[0024] S3, adding 5.0 kg of hexamethylenetetramine into the secondary mixture and stirring and mixing until the hexamethylenetetramine is completely dissolved to obtain the tertiary mixture;

[0025] S4, adding 5.0kg of urea to the three mixtures and stirring and mixing until the urea is completely dissolved to obtain the four mixtures;

[0026] S5. Add 0.2kg of benzotriazole into the mixture of four times and stir and mix until the benzotriazole is completely dissolved to obtain the mixture of five times;

[0027] S6. Add 0.1kg 2-thiouracil to the mixture for five times and stir and mix until the thiouracil is completely dissolved to obtain the mixture f...

Embodiment 2

[0031] S1. Mix and stir 1.0kg of monoethanolamine and 40kg of water until the monoethanolamine is completely dissolved to obtain a primary mixture;

[0032] S2. Add 0.5kg polyethylene glycol 300 into the primary mixture and mix and stir until the polyethylene glycol 300 is completely dissolved to obtain the secondary mixture;

[0033] S3, adding 8.0 kg of hexamethylenetetramine into the secondary mixture and stirring and mixing until the hexamethylenetetramine is completely dissolved to obtain the tertiary mixture;

[0034] S4, adding 10.0kg of urea to the three mixtures and stirring and mixing until the urea is completely dissolved to obtain the four mixtures;

[0035] S5. Add 0.2kg of benzotriazole into the mixture of four times and stir and mix until the benzotriazole is completely dissolved to obtain the mixture of five times;

[0036] S6. Add 0.1kg 2-thiouracil to the mixture for five times and stir and mix until the thiouracil is completely dissolved to obtain the mixtu...

Embodiment 3

[0040] S1. Mix and stir 0.8kg monoethanolamine and 46.3kg water until the monoethanolamine is completely dissolved to obtain a primary mixture;

[0041] S2. Add 0.9kg polyethylene glycol 300 into the primary mixture and mix and stir until the polyethylene glycol 300 is completely dissolved to obtain the secondary mixture;

[0042] S3. Add 3.0 kg of hexamethylenetetramine into the secondary mixture and stir and mix until the hexamethylenetetramine is completely dissolved to obtain the tertiary mixture;

[0043] S4, adding 2.0kg of urea to the three mixtures and stirring and mixing until the urea is completely dissolved to obtain the four mixtures;

[0044] S5. Add 0.1 kg of benzotriazole to the mixture of four times and stir and mix until the benzotriazole is completely dissolved to obtain the mixture of five times;

[0045] S6. Add 0.3kg 2-thiouracil to the mixture for five times and stir and mix until the thiouracil is completely dissolved to obtain the mixture for six times...

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Abstract

The invention relates to the technical field of printed circuit board process agents, in particular to a tin surface protective agent and a preparation method thereof. The tin surface protective agentcomprises, by weight, 3-8 parts of hexamethylenetetramine, 2-10 parts of urea, 0.7-1.1 parts of polyethylene glycol 300, 0.1-0.3 part of benzotriazole, 0.1-0.3 part of alkylbenzimidazole, 0.1-0.3 part of thiouracil, 0.5-1.0 part of monoethanolamine and 80-94 parts of water. During application of the tin surface protective agent, the redox potential of metal tin can be changed, the chemical reaction between the tin surface and strong alkali is harder, a protection film can be formed on the tin surface, and therefore strong alkali and the tin surface are isolated, and the function of protectingthe tin surface is achieved; and meanwhile, the thickness requirement of the tin surface of a circuit board can be reduced to 2-4 micrometers, the anti-etching requirement can be completely met, andtherefore the use level of metal tin is greatly saved, and conditions are created for reducing the enterprise cost.

Description

technical field [0001] The invention relates to the technical field of printed circuit board process preparations, in particular to a tin surface protectant and a preparation method thereof. Background technique [0002] As we all know, alkaline etching is an essential process in the processing of printed circuit boards. It usually means that after the copper plating process is completed on the circuit, a layer of tin is also plated on the surface of the copper to utilize the tin formed by electroplating. surface as an anti-etching layer, and then use strong alkali to peel off the dry film to etch out the circuit; since tin is an amphoteric metal, it will chemically react with strong alkali; therefore, when making printed circuit boards in the industry, 5-8μm is usually used The thickness of tin can achieve the effect of anti-etching (if the tin layer is too thin, the effect of anti-etching will often not be achieved). However, due to the high cost of metal tin and the inab...

Claims

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Application Information

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IPC IPC(8): C23F1/02C23F1/34H05K3/06
CPCC23F1/02C23F1/34H05K3/062
Inventor 李亚全王荣茹周国新
Owner 深圳市星扬高新科技有限公司
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