Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A silicon wafer rolling friction pair and rolling friction simulation method on the mesoscopic scale

A rolling friction and silicon wafer technology, applied in the field of friction and wear, can solve the problems of inability to accurately simulate rolling and wear conditions, and achieve the effect of saving research costs, simple structure of parts, and accurate simulation.

Active Publication Date: 2021-04-09
HOHAI UNIV
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide a silicon chip rolling friction pair and a rolling friction simulation method on the mesoscopic scale, so as to solve the problem that the existing technology cannot realize the rolling and wearing conditions of MEMS containing sliding / rotating parts. Problems with Accurate Simulation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A silicon wafer rolling friction pair and rolling friction simulation method on the mesoscopic scale
  • A silicon wafer rolling friction pair and rolling friction simulation method on the mesoscopic scale
  • A silicon wafer rolling friction pair and rolling friction simulation method on the mesoscopic scale

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A specific embodiment of the present invention discloses a silicon chip rolling friction pair on the mesoscopic scale, including: a rolling ball plate 3 and a silicon chip 4, specifically, the silicon chip 4 is fixed on the base 5, and the rolling ball plate 3 is Surface contact between the rolling ball 33 and the silicon wafer 4, the base 5 is driven to rotate by the test machine, when the silicon wafer 4 rotates synchronously with the base, the rolling ball 33 rolls relative to the silicon wafer 4, and a rolling motion is formed between the rolling ball 33 and the silicon wafer 4. friction pair.

[0044] The rolling ball disc 3 is installed on the upper fixture, specifically, the rolling ball disc 3 is installed on the clamp body 1 through the pin shaft 2 .

[0045] The upper clamp is a detachable structure, including: a clamp body 1 and a pin shaft 2 . Specifically, the clamp body 1 and the pin shaft 2 are fixed by pins or screws, and a through hole with a diameter ...

Embodiment 2

[0078] The difference between this embodiment and the first embodiment is that the cage 32 is provided with a circular ball mounting track, and a plurality of rolling balls 33 are installed in the ball mounting track of the cage 32 . Such as Figure 9 As shown, the cage 32 includes an outer ring and an inner ring. A first rolling ball installation groove with an arc-shaped cross section is provided on the inner side of the outer ring, and a second rolling ball installation groove with an arc-shaped cross-section is provided on the outer side of the inner ring.

[0079] Specifically, the inner ring and the outer ring are concentric, and the first rolling ball installation groove and the second rolling ball installation groove jointly constitute the above-mentioned rolling ball installation track, and the rolling ball 33 can rotate in the rolling ball installation track of the cage 32 and Do overall circumferential rotation.

Embodiment 3

[0081] This embodiment provides a method for simulating rolling friction, using the silicon wafer rolling friction pair of Embodiment 1 or Embodiment 2, comprising the following steps:

[0082] Step S1: Before the experiment starts, evenly coat the rough surface of the silicon wafer 4 to be tested with glue, and stick it on the platform 51 of the base 5, the base 5 is fixedly installed on the chassis of the testing machine, and the limiting structure 6 is set on the platform 51 And the periphery of the silicon wafer 4, and fixedly connected with the base 5, the silicon wafer 4 is limited by the limit structure 6, so as to prevent the silicon wafer 4 from slipping relative to the base 5, and prevent the failure of the experiment caused by degumming.

[0083] Step S2: There is a groove 21 at the bottom of the pin shaft 2, and the rolling ball disc 3 is clamped in the groove 21 of the pin shaft 2 through interference fit, so as to realize the tight fitting connection between the p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to a silicon chip rolling friction pair on a mesoscopic scale and a rolling friction simulation method, belonging to the field of friction and wear, and solves the problem in the prior art that the rolling friction and wear of a silicon chip on a mesoscopic scale is difficult to simulate. The rolling friction pair of the silicon chip on the mesoscopic scale of the present invention includes: an upper fixture, a rolling ball plate, a silicon chip and a base; the silicon chip is fixedly installed on the base; the rolling ball plate is fixed on the upper fixture; On the experimental machine, the experimental machine can drive the upper fixture to move down and the base to rotate, the fixture moves down, the rolling ball on the rolling ball plate contacts the silicon wafer, and rolls relative to the silicon wafer during the rotation of the silicon wafer. The invention realizes accurate simulation of friction and wear on the mesoscopic scale, and studies the effects of rolling speed, rolling ball size, load size, lubrication state and different lubricating media on the friction and wear state by controlling variables.

Description

technical field [0001] The invention relates to the field of friction and wear, in particular to a silicon chip rolling friction pair on a mesoscopic scale and a rolling friction simulation method. Background technique [0002] Minimizing wear or even achieving no wear is one of the keys to ensure the function and life of the MEMS system containing sliding / rotating parts, solve its reliability problems, and promote its practicality and marketization. [0003] Rolling wear on the mesoscopic scale is one of the main modes of wear failure of this type of MEMS system. However, there are no relevant mesoscopic-scale rolling friction pairs and experimental methods for friction and wear tests, and it is impossible to simulate the rolling and wearing conditions of MEMS with sliding / rotating parts, which seriously hinders the mesoscopic scale. A more in-depth study of rolling wear. [0004] Therefore, it is necessary to design a rolling friction pair and its test method for silicon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/56G01N3/02
CPCG01N3/02G01N3/56
Inventor 孙甲鹏王叶许冰倩杨振权付延涛吴国松
Owner HOHAI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com