Encapsulation method of laser waveguide chip

Abstract

The invention discloses an encapsulation method of a laser waveguide chip. The method comprises the following steps of: welding a laser chip and a thermistor on a first ceramic substrate; welding an optical waveguide chip on a second ceramic substrate; fixing the first ceramic substrate on the second ceramic substrate; electrically interconnecting the optical waveguide chip, the laser chip, the thermistor and the first ceramic substrate; attaching an avalanche photodiode chip on the substrate; welding a reflector bracket on which a reflector is attached, a semiconductor refrigerator, a secondceramic substrate and a substrate in a tube shell together, and enabling a photosensitive surface of the avalanche photodiode chip to be vertically aligned with a phase detection sheet of the opticalwaveguide chip; and encapsulating a filter on the surface of a tube shell. The invention has the advantages that: the APD (avalanche photodiode) chip is inverted above the optical waveguide chip in aninverted manner, so that the loss of light in a propagation process is reduced as much as possible, and a weaker optical signal can be detected.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging method for a laser waveguide chip. Background technique [0002] With the rapid development of lidar technology, optical waveguide devices have been widely used. In intelligent identification, unmanned driving and other application fields, lidar has become an indispensable core part, and optical waveguide has become the core device in lidar due to its small size, high integration, low loss and high reliability. . [0003] At present, in the packaging process of optical waveguide chips, it is impossible to achieve high integration of optical waveguide chips due to limitations of factors such as process and cost. In chip packaging, it is difficult to ensure both functionality and reliability and high integration of modules. The precise control of the phased array cannot be realized in the traditional optical waveguide module, and it takes a lot of time to debu...

AI Technical Summary

Problems solved by technology

[0003] At present, in the packaging process of optical waveguide chips, it is impossible to achieve high integration of optical waveguide chips due to factors such as technology and cost.

In chip packaging, it is difficult to ensure both functionality and reliability and high integration of modules

The precise control of the phased array cannot be realized in the traditional optical waveguide module, and it takes a lot of time to debug the chip light, which is not suitable for mass production of the module

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