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A kind of manufacturing method of LED flexible filament

A manufacturing method and filament technology, which are applied to semiconductor devices of light-emitting elements, lighting and heating equipment, electric solid-state devices, etc., can solve the problems of unreasonable temperature curve setting, virtual welding of LED chips, affecting reliability, etc. The effect of proportional short circuit failure, enhanced welding strength and high product reliability

Active Publication Date: 2022-04-05
LEEDARSON IOT TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing LED flexible filament manufacturing process is still in an immature stage, resulting in a large proportion of abnormal phenomena such as virtual soldering and short circuit of LED chips due to the small size of the substrate pad during the production process.
Moreover, the temperature curve setting of the common reflow soldering in the prior art is unreasonable, and it is easy to have flux residues affecting reliability, etc.

Method used

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  • A kind of manufacturing method of LED flexible filament
  • A kind of manufacturing method of LED flexible filament
  • A kind of manufacturing method of LED flexible filament

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Embodiment Construction

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0020] The present invention provides a mature LED flexible filament production process for the key process in the production process - tinning in order to solve the existing problems in the prior art, such as abnormal phenomena such as virtual soldering of LED chips, short circuit, etc., and solder flux residues affecting reliability. The temperature control of paste and reflow soldering makes the soldering area of ​​LED chips uniform, moderate in height, high in soldering strength, good in push-pull force, less flux residue, and high in product reliability.

[0021] The invention provides a method for manufacturing a flexible LED filament, wherein the flexible LED filament includes a flexible substrate, an LED chip, fluorescent glue, etc., the flexible substrate is made of O-state aluminum or FPC, and the flexible substrate is regularly arran...

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Abstract

The invention relates to a manufacturing method of an LED flexible filament. By controlling the amount of solder paste, the large proportion of short-circuit faults caused by the LED flexible filament at a high temperature for sealing bubbles is effectively reduced. At the same time, by setting the temperature range of reflow soldering, the flux in the solder paste can be effectively volatilized, and the welding strength is enhanced, so that the LED flexible filament can enter mass production normally, that is, to ensure a sufficiently high yield rate. The invention provides a mature LED flexible filament production process, which realizes LED chips with uniform welding area, moderate height, high welding strength, good push-pull force, less flux residue and high product reliability.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a method for manufacturing LED flexible filaments. Background technique [0002] The manufacturing process of the LED flexible filament in the prior art is still in an immature stage, which leads to a large proportion of abnormal phenomena such as virtual soldering and short circuit of the LED chip due to the small size of the substrate pad during the production process. Moreover, the setting of the temperature curve of the common reflow soldering in the prior art is unreasonable, and the residue of soldering flux is likely to affect the reliability and the like. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and provide a method for manufacturing LED flexible filaments, which can ensure that the LED chips have uniform welding area, moderate height, high welding strength, good push-pull force, less flux res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/90H01L33/52H01L33/62H01L25/075
CPCF21K9/90H01L33/52H01L33/62H01L25/0753
Inventor 陈慧武王其远蒋洪奎
Owner LEEDARSON IOT TECH INC
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