Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Internal power supply computing power unit chip

A chip and chip module technology, applied in the field of computing power unit chips with internal power supply, can solve the problems of not easy to expand the horizontal cascade circuit, increase the difficulty of wiring, and complicated selection of LDO chips.

Pending Publication Date: 2020-05-19
ZHEJIANG EBANG COMM
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the generation of virtual currency requires a large amount of computer computing power. Existing "mining" chips usually use high-performance GUP and other computing power chips to calculate complex mathematical problems, and as time goes by, the performance of computing power chips The power consumption ratio puts forward higher and higher requirements. The miniaturization of the chip structure and the reduction of power consumption can increase the income of "mining". Specifically, the PCB wiring in the existing technology is relatively complicated, which increases the difficulty of wiring; Expand the horizontal cascade circuit when improving the overall computing power. Due to the current limit, the LDO chip selection of the auxiliary power supply will be more complicated when the horizontal cascade is used.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Internal power supply computing power unit chip
  • Internal power supply computing power unit chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0028] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an internal power supply computing power unit chip, which is characterized by comprising a first chip module and a second chip module, wherein the first chip module comprises afirst power taking pin, a second power taking pin, a third power taking pin and a fourth power taking pin; the first power taking pin is directly and electrically connected with the second power taking pin through the interior of the first chip module; the third power taking pin is directly and electrically connected with the fourth pin through the interior of the first chip module, wherein the first chip module is electrically connected with the second chip module, the first chip module is connected with a VDDcore pin, the second chip module is connected with a first VSScore pin, and two sides of the second chip module are respectively connected with a data bus. The internal power supply calculation chip can supply power to the I / O and PLL without an external auxiliary power supply, anddoes not need to select the type of the auxiliary power supply, so that the manufacturing cost of a PCB and the system design time can be saved.

Description

technical field [0001] The invention relates to a computing power unit chip with internal power supply, in particular to a computing power unit chip with internal power supply. [0002] technical background [0003] As a decentralized virtual digital currency, bitcoin is widely used in various Internet trades due to its characteristics of decentralization and irrevocable transactions. In addition, as a virtual currency, bitcoin has low transaction costs. There is no need for high handling fees, which speeds up the liquidity of the market. At present, the generation of virtual currency requires a large amount of computer computing power. Existing "mining" chips usually use high-performance GUP and other computing power chips to calculate complex mathematical problems, and as time goes by, the performance of computing power chips The power consumption ratio puts forward higher and higher requirements. The miniaturization of the chip structure and the reduction of power consump...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F15/78G06F1/20G06Q20/06
CPCG06F15/7803G06F1/20G06Q20/065
Inventor 田飞
Owner ZHEJIANG EBANG COMM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products