Preparation process for semiconductor electronic components

Abstract

The invention relates to a preparation process for a semiconductor electronic components. The process involves a bottom plate, a placing frame, a supporting plate, a feeding device and a gluing device, wherein the placing frame is arranged at the upper end of the bottom plate, the supporting plate is arranged on the rear side of the placing frame, the supporting plate is arranged on the bottom plate, and the feeding device is arranged on the front end surface of the supporting plate. The process can solve the problems that when an existing device performs gluing on the two poles of the semiconductor electronic elements, the two poles of the semiconductor electronic elements cannot be simultaneously subjected to gluing, and the two poles of the semiconductor electronic elements of differentspecifications cannot be subjected to gluing, so that the utilization rate of the device is reduced; meanwhile, quantitative gluing cannot be achieved, and glue is prone to be accumulated at electrode copper feet, so that the glue consumption is increased, and the production cost is increased; and the glue in a gluing head cannot be completely sprayed out during gluing, so that blocking and wiredrawing are prone to be caused, other surrounding semiconductor electronic elements are influenced, the gluing efficiency is reduced, and the like.

Description

technical field [0001] The invention relates to the technical field of electronic component preparation, in particular to a semiconductor electronic component preparation process. Background technique [0002] A semiconductor electronic component is an electronic device whose conductivity is between a good conductor and an insulator, and uses the special electrical characteristics of semiconductor materials to complete specific functions. These semiconductor materials are mainly silicon, germanium or gallium arsenide. Semiconductor electronic components are mainly divided into It is widely used in the field of integrated circuits for crystal diodes, semiconductor discrete devices, bipolar transistors and field effect transistors. [0003] At present, when dispensing glue for the two poles of semiconductor electronic components, the existing equipment usually has the following deficiencies: 1. The existing equipment cannot dispens glue for the two poles of semiconductor elect...

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Problems solved by technology

[0005] The invention can solve the problem that the existing equipment cannot dispens glue to the two poles of the semiconductor electronic components at the same time, and can not dispens the two poles of the semiconductor electronic components of different specifications, thereby reducing the use of the equipment At the same time, quantitative dispensing cannot be achieved, and glue accumulation is prone to occur at the copper feet of the electrodes, thereby increasing the consumption of glue and increasing the production cost. Moreover, the glue in the dispensing head cannot be completely sprayed when spraying glue It is prone to clogging and wire drawing, which will affect other surrounding semiconductor electronic components and reduce the efficiency of dispensing.

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