MEMS microphone

A microphone and ASIC chip technology, which is applied in the field of MEMS microphones, can solve problems such as short circuit, breakdown open circuit, etc., and achieve the effect of improving reliability, avoiding open circuit or short circuit, and improving dustproof function

Active Publication Date: 2020-06-02
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a MEMS microphone, which aims to solve the problem of open circuit or short circuit caused by the breakdown of the buried resistance layer in the ASIC chip and the substrate by the electrostatic discharge current

Method used

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Examples

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no. 1 example

[0028] see Figure 1-2 , a kind of MEMS microphone of the present embodiment, comprises the housing 10 that has encapsulation cavity 110 and is installed in the MEMS chip 13 and ASIC chip 14 in the encapsulation cavity 110, and housing 10 comprises for installing MEMS chip 13 and ASIC chip The substrate 11 of 14 and the housing 12 surrounding the package cavity 110 with the substrate 11, the microphone also includes a first metal lead 17 electrically connecting the ASIC chip 14 and the substrate 11 and a second metal lead 17 electrically connecting the ASIC chip 14 and the MEMS chip 13. Lead wire 18, substrate 11 is provided with acoustic through-hole 111, and MEMS microphone also comprises the conductive dust-proof net 15 that is covered in acoustic through-hole 111 near the end of MEMS chip 13, and conductive dust-proof net 15, is fixed with conductive dust-proof net 15 The connected first ground pad 112, the first ground pad 116 provided on the outer surface of the substrat...

no. 2 example

[0037] see further Figure 3-4 , different from the first embodiment, the conductive dust-proof net 15 in this embodiment is fixed inside the substrate 11 . Specifically, a second installation groove 114 for accommodating the conductive dust-proof net 15 is provided between the inner surface and the outer surface of the substrate 11 , and the conductive dust-proof net 15 covers the middle position of the acoustic through hole 111 .

[0038] The MEMS microphone of the present embodiment improves the dust-proof function of the microphone by covering the conductive dust-proof net 15 on the acoustic through hole 111; A grounding pad 112 and the conduction of the first grounding pad 116, the ASIC chip 14 is electrically connected to the first metal lead 17, and the first metal lead 17 guides the static electricity in the ASIC chip 14 from the first The ground pad 116 is introduced into the ground layer of the external circuit of the terminal equipment, and the first ground pad 112...

no. 3 example

[0041] see further Figure 5-6 Different from the first embodiment and the second embodiment, the conductive dust-proof net 15 is arranged on the surface of the substrate 11 away from the MEMS chip 13, and the second grounding pad electrically connected to the conductive dust-proof net 15 is provided on the substrate 11 117 and the metal conductive member 19 electrically connecting the first metal lead 17 and the second ground pad 117, and the conductive dust filter 15 is electrically connected to the ground terminal of the external circuit.

[0042] It should be noted that the outer surface of the substrate 11 is provided with a first installation groove 113 for accommodating the conductive dust filter 15 , and the conductive dust filter 15 covers the end of the acoustic through hole 111 away from the MEMS chip 13 . The conductive dust-proof net 15 is arranged on the outer surface of the substrate 11, and the outer surface of the conductive dust-proof net 15 is at the same le...

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Abstract

The invention provides an MEMS microphone. The MEMS microphone comprises a shell, an MEMS chip and an ASIC chip, wherein the shell is provided with a packaging cavity; the MEMS microphone also comprises a conductive dustproof net which covers an acoustic through hole, a first grounding bonding pad fixedly connected with the conductive dustproof net, a first grounding soldering lug arranged on theouter surface of a substrate and electrically connected with the grounding end of an external circuit, and a metal conductive part electrically connected with the first metal lead, the first groundingbonding pad and the first grounding soldering lug at the same time. The first metal lead leads static electricity in the ASIC chip into the ground layer of an external circuit of the terminal equipment from the first grounding soldering lug or the conductive dustproof net through the guidance of the metal conductive part; the first grounding bonding pad guides static electricity in the substrateinto the ground layer of an external circuit of the terminal equipment through the first grounding soldering lug or the conductive dustproof net under the guidance of the metal conductive part, so that open circuit or short circuit caused by ESD current breakdown of the ASIC chip and the buried capacitor and buried resistor layer in the substrate can be avoided to a great extent.

Description

【Technical field】 [0001] The invention relates to the technical field of electroacoustic conversion, in particular to a MEMS microphone. 【Background technique】 [0002] MEMS microphone is a power transducer based on MEMS (micro electromechanical system) technology, which has the characteristics of small size, good frequency response characteristics, and low noise. With the development of miniaturization and thinning of electronic equipment, MEMS microphones are more and more widely used in electronic equipment. [0003] The functions of mobile terminals such as mobile phones and tablets are becoming more and more powerful. As the circuit boards become smaller and more integrated, the MEMS microphones in mobile phones are more and more vulnerable to static electricity. ESD (Electro-Static discharge) means "electrostatic discharge". ESD is a discipline formed since the middle of the 20th century to study the generation, harm and protection of static electricity. Therefore, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003
Inventor 柏杨饶成辉洪亭亭
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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