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Multilayer power divider circuit board drilling equipment and drilling method

A technology for drilling equipment and circuit boards, which is applied in the fields of printed circuit, printed circuit manufacturing, electrical components, etc. It can solve the problems of product PIM value not meeting the requirements, burrs, and rough hole walls, etc. The effect of reducing burrs and reducing roughness

Pending Publication Date: 2020-06-09
ZHEJIANG WANZHENG ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the existing power divider circuit board drills holes on the epoxy resin circuit board, the hole wall will be rough, and the roughness is greater than or equal to 80 microns, forming burrs and serious hole drape, resulting in the PIM value of the product (passive Intermodulation) does not meet the requirements, such as above -168dbm

Method used

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  • Multilayer power divider circuit board drilling equipment and drilling method
  • Multilayer power divider circuit board drilling equipment and drilling method

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Embodiment Construction

[0019] Specific embodiments of the present invention will be described in further detail below based on the accompanying drawings. It should be understood that the description of the embodiments of the present invention here is not intended to limit the protection scope of the present invention.

[0020] Please refer to figure 1 and figure 2 , The multi-layer power divider circuit board drilling equipment provided by the present invention includes a drilling machine 200, a fixture 300, a melamine backing plate 600, a heat-dissipating and lubricating aluminum sheet 400 and two buffer splints.

[0021] The drilling machine 200 includes a base 210, a support arm 220 connected to one side of the base 210, a lift drive unit 230 connected to the top of the support arm 220, connected to the output end of the lift drive unit 230 and positioned at the lift drive unit 230 The lower rotary drive unit 240 , the collet 250 connected with the rotation shaft of the rotary drive unit 240 a...

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PUM

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Abstract

The invention discloses a multilayer power divider circuit board drilling device, which comprises a drilling machine, a clamp, a heat dissipation and lubrication aluminum sheet and two buffer clampingplates, wherein the drilling machine comprises a base, a supporting arm connected with one side of the base, a lifting driving unit connected with the top of the supporting arm, a rotating driving unit which is connected with the output end of the lifting driving unit and located below the lifting driving unit, a chuck connected with a rotating shaft of the rotating driving unit and a drill bit detachably connected with the chuck; the heat dissipation and lubrication aluminum sheet is located above a multilayer power divider circuit board to be drilled, one buffer clamping plate is located above the heat dissipation and lubrication aluminum sheet, the other buffer clamping plate is located below the multilayer power divider circuit board, and the clamp is used for fixing the buffer clamping plates, the heat dissipation and lubrication aluminum sheet and the multilayer power divider circuit board. In this way, the roughness of the wall of a drilled hole can be reduced, burrs are reduced, orifice burrs are avoided, and the PIM value meets the requirement. The invention further provides a drilling method of the multilayer power divider circuit board.

Description

technical field [0001] The invention relates to the technical field of high-frequency circuit boards, in particular to a drilling device and a drilling method for a circuit board of a multilayer power divider. Background technique [0002] When the existing power divider circuit board drills holes on the epoxy resin circuit board, the hole wall will be rough, and the roughness is greater than or equal to 80 microns, forming burrs and serious hole drape, resulting in the PIM value of the product (passive Intermodulation) does not meet the requirements, such as above -168dbm. Contents of the invention [0003] In view of this, the present invention provides a multi-layer power divider circuit board drilling equipment and drilling method that reduce the roughness of the drilling hole wall, reduce the burr, avoid the opening of the hole and meet the requirements of the PIM value, to solve the above-mentioned problems. question. [0004] A multi-layer power divider circuit bo...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/0214
Inventor 徐正保夏杏军
Owner ZHEJIANG WANZHENG ELECTRONICS SCI & TECH