A preparation method and preparation system of a micro-led array substrate

Abstract

The present application discloses a preparation method and preparation system of a Micro-LED array substrate, wherein the method firstly obtains a vertical structure Micro-LED core particle, and the vertical structure Micro-LED core particle can be made smaller, which solves the problem of The problem of current crowding in the Micro-LED core grain; then obtain a fixed substrate with a plurality of limiting wells, the fixed substrate includes a first accommodation area and at least one second accommodation area, and the width of the second accommodation area is smaller than the first The width of the accommodation area is such that when the Micro-LED core is fixed to the fixed substrate, only the first electrode with a certain height difference can be accommodated by the second accommodation area, avoiding the contact between the first electrode and the second electrode and the first connection layer. The misconnection with the second connection layer achieves the purpose of improving the alignment accuracy of the Micro-LED chip and the fixed substrate during the mass transfer process.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and more specifically, to a method and system for preparing a Micro-LED array substrate. Background technique [0002] Micro-LED (miniature light-emitting diode) has the advantages of low power consumption, high color saturation and high response speed, and has become an important display device in the new generation of display technology. [0003] After the preparation of Micro-LED chips (or Micro-LED chips) is completed, a large number of Micro-LED chips need to be fixed to the fixed substrate. This process is called mass transfer (or mass transfer), and the current mainstream The mass transfer methods include Fine Pick / Place, Selective Release (Self-Assembly) and Self-Assembly (Self-Assembly). [0004] However, in the prior art, during the mass transfer process, there is a problem that the fixed position error between the Micro-LED chip and the fixed substrate is relatively l...

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Problems solved by technology

[0004] However, in the prior art, during the mass transfer process, there is a problem that the fixed position error between the Micro-LED chip and the fixed substrate is relatively large, that is, the electrodes of the Micro-LED chip cannot be fixed with the corresponding connection layer on the fixed substrate. connection, resulting in more dead pixels in the prepared Micro-LED array substrate, which is difficult to meet the use requirements

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