Semiconductor performance test method based on Internet of Things

Abstract

The invention discloses a semiconductor performance test method based on the Internet of Things, which belongs to the field of semiconductor testing. The performance of a semiconductor can be tested through a novel bipolar probe. On one hand, the test precision can be improved; on the other hand, the semiconductor can be effectively protected from being damaged in the testing process. A pressure control model is established by utilizing a same-sense pressure assembly. The pressure control in the test behavior process is simulated. The contact reliability and precision of the bipolar probe andthe semiconductor PAD can be improved. A contact signal is used to trigger a test condition. The contact protection of the semiconductor is further improved. After the test is finished, comparing withstandard data, recording and archiving are carried out. The test result is transmitted to the cloud in real time for backup and storage, and the identification code label is printed on the tested semiconductor, so that follow-up product classification and traceability of test records are facilitated. The comprehensiveness and reliability of semiconductor testing are improved, and great convenience is provided for query of semiconductor performance.

Description

technical field [0001] The invention relates to the field of semiconductor testing, and more specifically, to a semiconductor performance testing method based on the Internet of Things. Background technique [0002] A semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields. For example, a diode is a device made of a semiconductor. No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. The core units of most of today's electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in com...

AI Technical Summary

Problems solved by technology

[0004] At present, there are mainly two methods for chip performance testing. One is to use POGO-PIN probes, that is, there are spring devices inside the probes, which can be freely retracted. The disadvantage is that this type of probe is aimed at the micron-level PAD spacing, which cannot be applied due to the large error. The other is the hard probe test method. The hard probe tip is specially ground to make the tip reach 2-10um level, although It can cope with micron-scale pitch chips, but it is easy to cause damage to the metal layer of the chip PAD when used. Because it is a rigid contact, the pressure cannot be controlled, and there are often pinhole marks on the PAD. , deformation, and may cause permanent damage to the semiconductor chip, which not only interferes with the semiconductor performance test results, but also produces scrap products during the test. It is impossible to record and archive the test results for each semiconductor, and even the phenomenon of shoddy may occur

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