Half-cut liquid crystal film and processing method

Abstract

The invention relates to a half-cut liquid crystal film and a processing method, the half-cut liquid crystal film comprises a first substrate, a first conductive layer, a liquid crystal layer, a second conductive layer and a second substrate, and the half-cut liquid crystal film is characterized in that a half-cut line formed by half cutting is arranged at a preset distance in the edge of the liquid crystal film, and the half-cut line at least penetrates into one of the first conductive layer and the second conductive layer. According to the invention, through half-cutting, the two internal conductive layers are not conducted; accordingly, during full cutting, even if the conductive layer in the outermost edge is adhered, the electrical property of the whole liquid crystal film cannot be invalid; thus, in the machining process, during full cutting, a smooth outer tangent plane without slag falling can be obtained by utilizing the cutting advantage of the CO2 laser; during half-cutting,the electrical performance failure of the liquid crystal film can be avoided by utilizing the advantages of ultraviolet cutting, so that all the advantages of ultraviolet cutting and CO2 laser cutting in the prior art can be combined, the defects of ultraviolet cutting and CO2 laser cutting can be eliminated, and a required product can be obtained.

Description

【Technical field】 [0001] The invention relates to a liquid crystal film, in particular to a half-cut liquid crystal film and a processing method. 【Background technique】 [0002] With the development of the information society, the application of liquid crystal writing devices is becoming more and more common. At present, the industry of liquid crystal writing devices has begun to form in China and is developing at a high speed. In the prior art, a liquid crystal writing device usually includes a driving circuit board and a liquid crystal film, and the liquid crystal film includes a first substrate, a first conductive layer, a liquid crystal layer, a second conductive layer and a second substrate. The first conductive layer and the second conductive layer are usually formed by attaching conductive substances such as ITO to the first substrate and the second substrate. The liquid crystal layer is located between the first conductive layer and the second conductive layer, which...

AI Technical Summary

Problems solved by technology

When the ultraviolet laser is fully cut, the cutting part will cause the internal fracture of the material at the molecular level. Although it will not cause the upper and lower conductive layers to stick together and break the conduction, the cutting surface is not smooth enough, and the slag is serious, and the slag falls into the liquid crystal. When it is in the film and the shell, on the one hand, it will cause difficulties in subsequent assembly, and on the other hand, it will affect the writing of the finished product

CO 2 When the laser is fully cut, the liquid crystal film needs to be cut off, and the cutting energy required is relatively large. Although it can make the cut surface smooth without slag, it is very easy to cause the first conductive layer and the second conductive layer to stick together. Together, this leads to the failure of the electrical properties of the liquid crystal film - causing a short circuit problem, making the product's drive circuit board unable to power on the liquid crystal film normally and unable to complete the handwriting removal action

[0004] Therefore, for the technology, the required size of the liquid crystal film formed after full cutting either has the problem of conductive layer adhesion and easy short circuit, or has the problem of slag drop, so it needs to be further improved.

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