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Diode packaging method

A packaging method and diode technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced production efficiency of diodes, uneven baking temperature, long baking time, etc., to avoid glue cracking, ensure hardening effect, Improves the effect of baking

Pending Publication Date: 2020-06-19
孙文
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Problems solved by technology

[0003] In-line LEDs need to use NP light-emitting diodes, and light-emitting diodes need to go through steps such as solid crystal and baking during production. During baking, due to uneven baking temperature or long baking time, the diodes often suffer from poor hardening. The problem of glue cracking, thereby causing the production efficiency of the diode to decline, accordingly, the present invention proposes a packaging method for the diode

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Embodiment Construction

[0029]In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0030] Such as Figure 1 to Figure 6 Shown, a kind of diode packaging method described in the present invention comprises the following steps:

[0031] S1: Inspect the bracket, the main test items are the appearance size, the thickness of the electroplating layer, and whether there is oxidation; then bake the bracket, mainly to remove the residual water vapor in the injection molding process of the bracket; Bracket plasma cleaning, plasma cleaning is mainly to form an arc with hydrogen and oxygen inside the equipment to remove residual organic matter on the surface of the bracket and improve the bonding force of the solid crystal;

[0032] S2: Bond the chip on the bracket treated in S1 with a die-bonding adhesive through an automatic die-bonding m...

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Abstract

The invention belongs to the technical field of diode production, in particular to a diode packaging method. A baking device used in the method comprises a bottom plate, a baking oven, a bracket and afixing frame are fixed to the top end of the bottom plate. A circular groove is formed in the side, facing the fixing frame, of the baking oven. A push rod motor is fixed to the top end of the fixingframe. A sealing disc is fixed to the output shaft end of the push rod motor. The sealing disc is in clearance fit with the circular groove, two or more containing pipes are rotationally installed onthe side, away from the push rod motor, of the sealing disc, a telescopic rod is fixed in the circular groove, the free end of the telescopic rod is fixed to the sealing disc, and a driving motor isfixed to the end, away from the push rod motor, of the baking oven. The rotating sealing disc drives the containing pipes to rotate along the axis of the sealing disc so that the position of the lightemitting diode placed in the containing pipes continuously changes and the heat absorbed by the light emitting diode is uniform.

Description

technical field [0001] The invention belongs to the technical field of diode production, in particular to a diode packaging method. Background technique [0002] Diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). It is the first semiconductor device in the world. It has unidirectional conductivity and rectification function. Diodes come in a wide variety and are mainly used in electronic circuits and industrial products. After years of unremitting efforts by scientists, the application of semiconductor diode light-emitting has been gradually promoted, and the application range of light-emitting diodes has gradually expanded. It is a light source that meets the requirements of green lighting, which is unmatched by ordinary light-emitting devices. [0003] In-line LEDs need to use NP light-emitting diodes, and light-emitting diodes need to go through steps such as solid crystal and baking during production. During baking, due t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L21/67
CPCH01L21/67098H01L33/48H01L33/52
Inventor 孙文吴宇祥
Owner 孙文
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