Microchannel Diode Laser

A micro-channel and laser technology, applied in semiconductor lasers, semiconductor laser devices, lasers, etc., can solve problems such as insufficient laser optical power

Active Publication Date: 2021-09-10
SHIJIAZHUANG MAITEDA ELECTRONICS TECH CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a microchannel semiconductor laser, aiming to solve the problem of insufficient optical power of existing lasers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Microchannel Diode Laser
  • Microchannel Diode Laser
  • Microchannel Diode Laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0045] Please also refer to Figure 1 to Figure 17 , the micro-channel semiconductor laser provided by the present invention will now be described. The micro-channel semiconductor laser includes a base 6, a first micro-channel laser packaging module, a second micro-channel laser packaging module, a light exit window 8 and a sealed housing 1, and the base 6 is provided with a water inlet 4, a water outlet 5, and a communication port The circulating cooling channel of the water inlet 4 and the water outlet 5; the first microchannel laser packaging module is arranged o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a micro-channel semiconductor laser, which belongs to the field of semiconductor optoelectronic technology, and includes a base, a first micro-channel laser packaging module, a second micro-channel laser packaging module, a light output window and a sealed housing, and the base is provided with a water inlet and a water outlet. And a circulating cooling channel; the first micro-channel laser package module includes a first micro-channel heat sink and a first laser chip packaged on the first micro-channel heat sink; the second micro-channel laser package module includes a second micro-channel heat sink and The second laser chip is packaged on the second microchannel heat sink, the first laser chip and the second laser chip are arranged at an acute angle, and the light beam emitted by the first laser chip overlaps with the light beam emitted by the second laser chip. In the micro-channel semiconductor laser provided by the present invention, two laser chips are arranged at an acute angle, and the emitted light beams intersect and superimpose to realize the superposition of optical power, improve the intensity and density of optical power, and meet the requirements of industrial processing.

Description

technical field [0001] The invention belongs to the technical field of semiconductor optoelectronics, and more specifically relates to a microchannel semiconductor laser. Background technique [0002] With the continuous improvement of the performance of semiconductor laser chips and the continuous decline of production costs, high-power laser devices represented by wavelengths such as 8xx, 9xx, and 106x have become the core devices of laser processing systems and play an increasingly important role in the field of laser manufacturing. role. [0003] The laser is used in industrial processing, and it needs a certain amount of optical power to heat up and process. If the optical power is insufficient, the power density is not enough, and the processing effect cannot be achieved. At present, the optical fiber coupling output and the focusing lens are used for energy concentration to increase the power density, but the power is insufficient to achieve the processing effect. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/02257H01S5/02315H01S5/024H01S5/40
CPCH01S5/02423H01S5/4012H01S5/02257H01S5/023H01S5/0233H01S5/0235
Inventor 闫立华徐会武李德震任浩
Owner SHIJIAZHUANG MAITEDA ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap