A stacking packaging process for semiconductor devices and semiconductor devices

Abstract

Embodiments of the present invention provide an overlay packaging process for a semiconductor device, and a semiconductor device. The process comprises the following steps: manufacturing a main wafer, and retaining a packaging and bonding region on the front surface of the main wafer; manufacturing a secondary wafer, retaining a packaging and bonding region on the front surface of the secondary wafer, and forming several grooves on the front surface of the secondary wafer; bonding the packaging and bonding regions of the main wafer and the secondary wafer to achieve the overlay of the two wafers; and grinding or thinning the back surface of the secondary wafer until at least a part of the region of the main wafer is exposed from the groove. The process is very suitable for manufacturing a two-in-one chip and a duplexer chip, and particularly for manufacturing an acoustic wave filter. A new wafer level overlay packaging structure provided by the present invention achieves wafer level packaging in a die overlay mode, and simultaneously has the functions of two dies, and thus, a packaging volume and the area of the die can be greatly reduced, and the volume ratio of two independent packaged dies merely is about 60%.

Description

Technical field [0001] This application belongs to the field of semiconductor devices, in particular to a stacking and packaging process for semiconductor devices and semiconductor devices. Background technique [0002] As a semiconductor device, filters are widely used in many wireless cellular terminals (including 2G / 3G / 4G / 5G mobile phones, WiFi, Pads, smart watches, IOTs, automobiles and other terminal scenarios). The transmitting end (TX) and receiving end (RS) of the mobile communication system must be filtered by the filter before they can play a role. Since its working frequency band is generally 800MHz~2GHz, and the bandwidth is 17MHz~30MHz, the filter is required to have low insertion loss , High stop band suppression and high image attenuation, withstand high power, low cost, miniaturization and other characteristics. Compared with piezoelectric ceramic filters and monolithic crystal filters, surface acoustic wave filters have obvious advantages in terms of working fre...

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Problems solved by technology

When integrated into the module by wafer bonding packaging, it is not sensitive to injection pressure, the product thickness is large, and the wiring is complicated and requires TSV conduction, so the process control is difficult and the cost is high.

The thin film packaging method can make the product very thin, but it involves multiple photolithography and thin film deposition processes, which makes the process difficult and costly, and is sensitive to injection molding pressure, so it cannot be used for the stacked packaging of two dies.

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