34results about How to "Overlay realization" patented technology

The embodiment of the invention discloses a method and device for superimposing coding, relating to the wireless communication field. In the method and device for superimposing the coding, constellation superimposing coding can be realized aiming at a plurality of transmission stations. The method for superimposing the coding provided by the embodiment of the invention comprises the following steps: obtaining transmission parameter information of an superimposed signal needed to be transmitted by a base station; adjusting the transmission parameters of the superimposed signal in the station according to the transmission parameter information of the superimposed signal; and transmitting the superimposed signal according to the adjusted transmission parameters to carry out constellation superimposing coding on the superimposed signal and the superimposed signal transmitted by the base station. The method and device for superimposing the coding is suitable for the constellation superimposing coding with a plurality of the transmission stations.

A laminate flooring colorized solid sealing wax comprises, by weight, 50-85% of paraffin, 10-45% of a polymer material, 1-8% of an organic pigment, and 1-8% of a surface modifier. A preparation method of the laminate flooring colorized solid sealing wax comprises the following steps: weighing required raw materials according to above proportions, fuse-mixing the raw materials, and cooling. Lock catches of wood floors processed with the laminate flooring colorized solid sealing wax have moisture-proof lubrication effects of the lock catches of the floors processed with traditional paraffin, and the colorized solid sealing wax is configured according to the color of the floor surface to unify the floor in color to effectively cover base materials at the lock catches of the floors, so a uniform color effect is obtained, and the overall aesthetic degree of the floor is greatly improved.

The invention is applicable to the video image processing technology field. The invention discloses a high definition video OSD menu superposition module based on FPGA and a method. A special-purpose character chip is superposed in a video stream; the OSD menu superposition module comprises a soft core processor and an OSD controller; the OSD controller is connected to video input and video output; and the main port and the slave port of the OSD controller are connected to the main port of the soft core processor and a slave port of a storage device. Through the modification of the code, the character superposition can be more easily displayed on the high definition display or on the super high definition display, code transplantation is easy, the flexibility and expandability can be fully realized, and the poor reliability of adopting a single-chip microcomputer to control time series can be avoided.

The invention provides a hand-held ETC reader and an employed RFID and AR fusion method thereof, and used for displaying information of an ETC vehicle equipped with an OBU. The hand-held ETC reader comprises a short-range communication module, an ETC database, a phased-array antenna, an electronic compass, an AR information display assembly, an image recognition assembly, a camera, and a processor, the short-range communication module reads MACID and data information of the OBU and transmits the MACID and the data information to the AR information display assembly, the ETC database is connected with the short-range communication module and the AR information display assembly, the phased-array antenna obtains position information of the OBU and is connected with the AR information display assembly, the electronic compass obtains coordinate information of the reader and is connected with the AR information display assembly, and the image recognition assembly is connected with the AR information display assembly and the camera. According to the hand-held ETC reader, the processor transmits the position information of the ETC reader and the position information and the data information of the OBU to the AR information display assembly, the image recognition assembly performs matching of the position information of the OBU and the vehicle position, and fusion and superposition of various information can be realized.

The embodiment of the invention provides a superposition packaging process for a semiconductor device and the semiconductor device, and the process comprises the following steps: preparing a main wafer, and reserving a packaging bonding region on the front surface of the main wafer; preparing an auxiliary wafer, reserving a packaging bonding area on the front surface of the auxiliary wafer, and processing a plurality of grooves on the front surface of the auxiliary wafer; bonding the packaging bonding areas of the main wafer and the auxiliary wafer together to realize superposition of the twowafers; and grinding or thinning the back surface of the auxiliary wafer until at least part of the area of the main wafer is exposed out of the groove. The process is very suitable for manufacturingtwo-in-one and duplexer chips, and is particularly suitable for manufacturing acoustic wave filters. The invention provides a novel wafer-level stacking packaging structure, wafer-level packaging in adie stacking mode is achieved, the structure has the functions of two chips, the packaging size and the chip area can be greatly reduced, and the size of the structure is only about 60% compared withthe sizes of the two independently packaged chips.

The invention discloses an image superposition method, an image superposition device, and electronic equipment. The image superposition method comprises the steps of: converting a first image in a first format into a third image and a fourth image, wherein the third image is a color component image in a second format, and the fourth image is a transparent component image in the second format; andsuperposing the color component image, the transparent component image and a second image in a second format to generate a superposed target image. According to the image superposition method and theimage superposition device, the superposition of images can be realized by using fewer computing resources, and the computing resources are saved.

The invention is applied to the field of cultivated land resource management, and provides a cultivated land requisition-compensation space auditing method and device. The method comprises the steps that multiple to-be-overlaid layers are acquired, wherein each to-be-overlaid layer comprises vertex coordination information; the to-be-overlaid layer with the largest area in the to-be-overlaid layer is acquired; spatial overlaying is conducted on the to-be-overlaid layer with the largest area and an occupied layer, and the area of the overlaying part of the layers and the corresponding cultivated land quality grades are acquired; spatial overlaying is conducted on the remaining non-overlaid to-be-overlaying layers and the occupied layer, and the area of the overlaying part of the layers and the corresponding cultivated land quality grades are acquired; the area of the overlaying part of the layers and the corresponding cultivated land quality grades are matched with a compensation layer, and auditing information comprising a matching result is output. In this way, the spatial area of the data overlaying parts of the layers is accurately calculated, and therefore the auditing efficiency and precision can be improved.

The invention provides an image display method and device, which are applied to a control device in a holographic projection system. The holographic projection system further comprises a transparent holographic display screen, a projection device and an image acquisition device, wherein the projection device and the image acquisition device are located on one side of a first display surface of the transparent holographic display screen. The method comprises the steps of acquiring a scene freeze-frame instruction; acquiring a mixed reality image corresponding to a mixed reality scene, wherein the mixed reality scene comprises a virtual scene presented by the transparent holographic display screen and at least one real figure located on one side of a second display surface of the transparent holographic display screen; extracting a user image of at least one user who is a real character from the mixed reality image; superposing the user image of the at least one user on a virtual scene image to be projected so as to obtain a real freeze-frame image to be projected; and projecting the real freeze-frame image to the first display surface of the transparent holographic display screen through the projection device. According to the scheme, the action image of the real person before a current moment can be presented in the virtual scene.

The invention discloses a bandwidth expansion system based on a GEPON system. A bandwidth expansion channel is composed of a local intelligent shunt transmitter (DLT) and a terminal intelligent shuntreceiver (DNU), and the GEPON system comprises a local side OLT and a terminal ONU. According to the bandwidth expansion scheme of the GEPON system, a downlink broadcast channel is seamlessly superposed on the basis of the existing GEPON system, so the downlink bandwidth is effectively increased. And the requirements of large-capacity access services in the future are met.

The invention discloses a strain purified silicon substrate for semiconductor quantum calculation and a forming method thereof, belongs to the technical field of semiconductors, and aims to solve theproblems that epitaxial purified silicon is greatly influenced by natural silicon isotope components of a substrate and the electron mobility of a purified silicon layer is low in the prior art. The strain purified silicon substrate comprises a natural silicon substrate, an insulating layer and a strain purification silicon layer, and tensile stress is introduced into the strain purification silicon layer. The forming method comprises the following steps: epitaxially forming a plurality of silicon-germanium buffer layers on a base substrate, gradually increasing the germanium doping concentration in the plurality of silicon-germanium buffer layers, and forming a strain purification silicon layer on the silicon-germanium buffer layers to obtain a donor substrate; providing a natural siliconsubstrate; forming an insulating layer on the donor substrate and/or the natural silicon substrate; and bonding the donor substrate with a natural silicon substrate, and removing the silicon-germanium buffer layer and the base substrate to obtain the strain purified silicon substrate. The strain purified silicon substrate and the forming method can be used for semiconductor quantum calculation.

The invention discloses a fabric weft density measuring method. The measuring method comprises the following steps: collecting the images of a fabric on a production line, and obtaining the image of the fabric; processing the image of the fabric, and converting the image into a one-dimensional vector; performing wave filtering processing on the one-dimensional vector by using a band pass wave filter, and setting a value without in a measuring range to '0' so as to obtain an output signal; performing sequencing on the output signal, and calculating weft number WeftNum; according to the weft number WeftNum and the actual height H, corresponding to the image of the fabric, of the fabric, calculating a weft density value WeftDensity=WeftNum/H. The invention further discloses fabric weft density measuring equipment. Through the adoption of the fabric weft density measuring method disclosed by the invention, the weft density value of the fabric moving on the production line can be detected accurately in real time, the error is small, the operation is simple and convenient, the automation control degree is high, and the application range is broad.

The invention discloses an image character superposing method based on an FPGA. The method comprises the following steps: sequentially traverse the starting points of single character areas from a preset pixel position of an image; according to a preset first mapping table, determining whether characters need to be superposed in the character area to which the starting point belongs, and accordingto the preset first mapping table, obtaining character contents needing to be superposed in the character area; acquiring character content actually superposed in the character area according to thecharacter content attribute; searching a second mapping table according to the actually superimposed character content, and obtaining memory address data of superimposed character bitmap information;traversing and reading each piece of pixel data in the superposed character bitmap information according to the memory address data, and writing the pixel data into image pixels. According to the method, real-time and efficient character information superposition of the image can be realized only by using few resources in the FPGA, and the superposition position, the superposition content and thesuperposition character display can flexibly adapt to the character superposition requirement.

The invention discloses a storage box convenient to stack and use. The storage box is characterized in that the storage box comprising a frame, a cover plate, movable side plates and a bottom plate; the edge of the top wall of the frame is provided with a plurality of limiting walls used for limiting the storage box stacked above the frame, the frame is further provided with an upper opening, a side opening and a lower opening; the cover plate detachably covers the upper opening; the movable side plate is hinged with the corresponding side opening of the frame and can open and close the side opening; and the bottom plate is detachably matched on the lower opening. By means of the storage box convenient to stack and use, a plurality of storage boxes can be conveniently stacked and used, andusing the stacked storage boxes in a multifunctional mode can be carried out.

The invention relates to a modular foldable ultraviolet LED light source module, and belongs to the technical field of LED light sources. A light beam, transmitting a first light combiner, of a firstlight beam in the modular foldable ultraviolet LED light source module and a second light beam converge through a light beam reflected by the fist light combiner to form a first combined light beam, the light beam, transmitting a second light combiner, of the first combined light beam and a third light beam converge through a light beam reflected by the second light combiner to form a second combined light beam, the light beam, transmitting a third light combiner, of the second combined light beam and a fourth light beam converge through a light beam reflected by the third light combiner to form a third combined light beam, and light overlaying is sequentially achieved in this manner. In conclusion, the modular foldable ultraviolet LED light source module can achieve higher light power, and meanwhile more light modules identical in structure can be superposed. Due to the fact that the beam-divergence angle is small, the energy density of the light beams is superposed after the modulesare finitely superposed, and other features do not obviously change.

According to the electric heating aging test platform for the capacitor with the direct current superposed with the harmonic waves, a temperature control air blowing box is provided with a closed cavity so as to maintain the environment temperature of a capacitor test object in the temperature control air blowing box, and a variable-frequency power source provides sine-wave voltages with different frequencies and different amplitudes; the isolation capacitor is connected in series with the variable-frequency power supply and then connected in parallel with the capacitor test object, the isolation capacitor isolates direct-current voltage to enable voltage applied to two ends of the capacitor test object to be direct-current superposition harmonic voltage, and the direct-current power supply provides direct-current voltage with different amplitudes; the protection resistor is connected in series with a DC power supply and then connected in parallel with a capacitor sample The thermodetector is connected with the temperature control blast box and monitors temperature data of the capacitor test object and the temperature control blast box in real time; the oscilloscope is connected with the capacitor test object to measure actual voltage values applied to two ends of the capacitor test object.

The invention discloses a strain purified silicon substrate for semiconductor quantum calculation and a forming method thereof, belongs to the technical field of semiconductors, and aims to solve theproblems that epitaxial purified silicon is greatly influenced by natural silicon isotope components of a substrate and the electron mobility of the purified silicon is low in the prior art. The purified silicon germanium substrate comprises a natural silicon supporting substrate, an insulating layer, a purified silicon germanium layer and a purified silicon layer which are stacked in sequence. The forming method comprises the following steps: epitaxially forming a plurality of silicon-germanium buffer layers and purified silicon-germanium layers on a base substrate to obtain a donor substrate; providing a natural silicon support substrate; forming at least one insulating layer on the donor substrate and/or the natural silicon support substrate; bonding the donor substrate with a natural silicon support substrate, and removing the base substrate and the multiple silicon-germanium buffer layers or removing the base substrate, the multiple silicon-germanium buffer layers and part of thepurified silicon-germanium layer to obtain a purified silicon-germanium substrate; and epitaxially forming a purified silicon layer on the purified silicon germanium substrate to obtain the strain purified silicon substrate. The purified silicon germanium substrate and the forming method thereof can be used for semiconductor quantum calculation.