The invention discloses a secondary epitaxy method of an N-type heavily-doped thin-layer gallium nitride material. The method comprises the following steps: (1) selecting an epitaxial material, and placing the epitaxial material on a base in MOCVD epitaxial growth equipment; (2) setting the pressure of a reaction chamber, heating the reaction chamber to a preset temperature in an ammonia gas atmosphere, and then continuously introducing an indium source; (3) keeping the pressure, the temperature, the indium source flow and the ammonia gas flow of the reaction chamber unchanged, and introducing a gallium source and silane; adjusting the flow of the gallium source and the indium source, setting the growth rate, and starting secondary epitaxy of the N-type heavily doped thin layer GaN material; (4) keeping the pressure, the temperature and the ammonia gas flow of the reaction chamber unchanged, closing the gallium source and the indium source, and continuously introducing silane for a period of time; and (5) closing the silane, cooling to room temperature under the protection of ammonia gas atmosphere, and taking out the secondary epitaxial material. The N-type heavily-doped thin-layer GaN material is good in surface appearance and high in crystallization quality, and ohmic contact resistance of a high-frequency GaN power device can be reduced.