Stacked packaging process for semiconductor device and semiconductor device

Abstract

The embodiment of the invention provides a superposition packaging process for a semiconductor device and the semiconductor device, and the process comprises the following steps: preparing a main wafer, and reserving a packaging bonding region on the front surface of the main wafer; preparing an auxiliary wafer, reserving a packaging bonding area on the front surface of the auxiliary wafer, and processing a plurality of grooves on the front surface of the auxiliary wafer; bonding the packaging bonding areas of the main wafer and the auxiliary wafer together to realize superposition of the twowafers; and grinding or thinning the back surface of the auxiliary wafer until at least part of the area of the main wafer is exposed out of the groove. The process is very suitable for manufacturingtwo-in-one and duplexer chips, and is particularly suitable for manufacturing acoustic wave filters. The invention provides a novel wafer-level stacking packaging structure, wafer-level packaging in adie stacking mode is achieved, the structure has the functions of two chips, the packaging size and the chip area can be greatly reduced, and the size of the structure is only about 60% compared withthe sizes of the two independently packaged chips.

Description

technical field [0001] The present application belongs to the field of semiconductor devices, in particular to an overlay packaging process for semiconductor devices and semiconductor devices. Background technique [0002] As a semiconductor device, filters are widely used in many wireless cellular terminals (including 2G / 3G / 4G / 5G mobile phones, WiFi, Pad, smart watches, IOT, automobiles and other terminal scenarios). The transmitting end (TX) and receiving end (RS) of the mobile communication system must be filtered by the filter before they can play a role. Since the operating frequency band is generally 800MHz-2GHz and the bandwidth is 17MHz-30MHz, the filter is required to have low insertion loss. , High stop band suppression and high image attenuation, high power withstand, low cost, miniaturization and so on. Compared with piezoelectric ceramic filters and monolithic crystal filters, surface acoustic wave filters have obvious advantages in terms of operating frequency...

AI Technical Summary

Problems solved by technology

When integrated into the module by wafer bonding packaging, it is not sensitive to injection pressure, the product thickness is large, and the wiring is complicated and requires TSV conduction, so the process control is difficult and the cost is high.

The thin film packaging method can make the product very thin, but it involves multiple photolithography and thin film deposition processes, which makes the process difficult and costly, and is sensitive to injection molding pressure, so it cannot be used for the stacked packaging of two dies.

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