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OLED panel with special packaging structure

A technology of encapsulation structure and encapsulation cover plate, which is applied in the field of OLED panels, can solve the problems of high damage ratio of OLED display modules, and achieve the effects of reducing the risk of rupture, reducing force, and increasing the overlapping area

Inactive Publication Date: 2020-06-30
XIAN ZHISHENG RUIXIN SEMICON TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in practical applications, it is found that the damage rate of OLED display modules is relatively high when dropped

Method used

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  • OLED panel with special packaging structure
  • OLED panel with special packaging structure
  • OLED panel with special packaging structure

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Embodiment Construction

[0033] The content of the present invention will be further described below in conjunction with specific examples, but the embodiments of the present invention are not limited thereto.

[0034] See figure 1 and figure 2 , figure 1 It is a cross-sectional view of an OLED panel with a special packaging structure provided by an embodiment of the present invention; figure 2 It is a structural perspective view of a package cover plate provided by an embodiment of the present invention; image 3 It is a structural perspective view of a substrate provided by an embodiment of the present invention. The OLED panel of this embodiment includes an OLED device 1, a substrate 2, and an encapsulation cover 3 arranged opposite to the substrate 2, wherein the surface of the encapsulation cover 3 opposite to the substrate 2 is provided with an accommodating recess for encapsulating the OLED device 1. Groove 31. Specifically, the accommodating groove 31 has a cuboid structure, and its siz...

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Abstract

The invention relates to an OLED panel with a special packaging structure. The OLED panel comprises an OLED device, a substrate, and a packaging cover plate opposite to the substrate. An accommodationgroove is formed in the surface, opposite to the substrate, of the packaging cover plate and is used for packaging an OLED device. The surface, opposite to the substrate, of the packaging cover platecomprises a first convex part surrounding the accommodating groove and a second convex part surrounding the first convex part; the surface, opposite to the packaging cover plate, of the substrate isprovided with a packaging glue groove matching the first convex part and a drying agent groove matching the second convex part. A packaging adhesive is arranged between the packaging glue groove and the first convex part, and a first drying agent is arranged between the drying agent groove and the second convex part; a buffer structure is arranged on the surface, located between the first convex part and the accommodation groove, of the packaging cover plate. According to the OLED panel, the packaging glue groove and the first convex part are additionally arranged on the packaging cover plateand the substrate respectively, so that the contact surface with the packaging glue is increased, and the packaging strength is improved.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to an OLED panel with a special encapsulation structure. Background technique [0002] Compared with the traditional TFT-LCD (thin film transistor-liquid crystal display, thin film transistor liquid crystal display) technology, OLED (Organic Light-Emitting Diode, organic electroluminescent device) has the advantage of being able to be made into a flexible device, and its application range is wider wide. According to the driving method, OLED can be divided into passive OLED and active OLED. Active OLEDs are driven by thin-film transistors, and each pixel is individually lit. It has the advantages of high brightness, high resolution, low power consumption, easy colorization, and large-area display. It is a commonly used method now. [0003] At present, the biggest problem restricting the development of the OLED industry is the short lifespan. The main reason for the sho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/822H10K50/841H10K50/8426
Inventor 韩阳王萌
Owner XIAN ZHISHENG RUIXIN SEMICON TECH CO LTD
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