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Flip chip backside emitting VCSEL package and manufacturing method thereof

A technology of vertical cavity surface emission and fabrication method, which is applied in the field of flip-chip vertical cavity surface emitting lasers

Pending Publication Date: 2020-06-30
OEPIC SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This will significantly increase the junction temperature of the VCSEL device when heat cannot be rapidly removed from the front side of the wafer

Method used

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  • Flip chip backside emitting VCSEL package and manufacturing method thereof
  • Flip chip backside emitting VCSEL package and manufacturing method thereof
  • Flip chip backside emitting VCSEL package and manufacturing method thereof

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Embodiment Construction

[0032] The following description in conjunction with the accompanying drawings is intended to illustrate the presently preferred embodiments of the present invention, not to represent the only form of constructing and / or using the present invention. This description sets forth the functions and sequence of steps for making and operating the invention in conjunction with the illustrated embodiments. However, it should be understood that the same or equivalent functions and sequences can be implemented by different embodiments, and these embodiments are also intended to encompass the spirit and scope of the present disclosure.

[0033] Please refer to Figures 1A-1B , reference may be made to a manufacturing method for forming a flip chip bottom emitting vertical cavity surface emitting laser package 10 in an embodiment of the present invention. VCSEL package 10 has several advantages over conventional designs: (1) flip-chip configuration using one-step solder reflow assembly p...

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Abstract

The invention discloses a flip chip backside emitting VCSEL package and manufacturing method thereof. The manufacturing method comprises the following steps: forming a VCSEL column array; coating a dielectric layer on the VCSEL column array, filling the grooves among the columns with the dielectric layer to form the VCSEL column array and cover the column body; flatting the VCSEL column array to remove the dielectric layer covering the column body, so that a metal layer is exposed on one top surface of the column body; coating a metal coating on the metal layer on one top surface of the columnbody, wherein the metal coating defines a contact pattern of the VCSEL column array; and coating solder on the metal coating to inversely mount the VCSEL column array on a substrate package. The requirements of connecting wires and connecting pads can be eliminated, the area of the VCSEL of the flip chip is reduced, and the subsequent photo-etching and metal related processes are simplified.

Description

【Technical field】 [0001] The present invention relates to a vertical cavity surface emitting laser (vertical cavity surface emitting lasers; VCSELs), in particular to a flip-chip vertical cavity surface emitting laser, which can eliminate the need for connecting wires and connecting pads to reduce flip-chip vertical cavity The area of ​​the surface-emitting laser and the planarization structure of grooves formed between the pillars in the vertical-cavity surface-emitting laser pillar array are used to simplify the subsequent photolithography and metal-related processes. 【Background technique】 [0002] Semiconductor lasers are used in many imaging applications that require high-power illumination, such as structured light sources for 3D imaging, laser detection and ranging (LADAR), time-of-flight ranging (TOF) 3D imaging, aerospace defense, and fusion research, etc. . Vertical-cavity surface-emitting lasers (VCSELs) have been widely used in many semiconductor lasers due to t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/183H01S5/022
CPCH01S5/183H01S5/022H01S5/026H01S5/423H01S2301/176H01S5/18305H01S5/18388H01S5/04254H01S5/0234H01S5/0237H01S5/02345H01S5/18341H01S5/18369
Inventor 鲍益勤
Owner OEPIC SEMICON