Check patentability & draft patents in minutes with Patsnap Eureka AI!

Silicon-based modulator and modulation device

A modulator, silicon-based technology, applied in the field of optical communication, can solve the problems of increased optical loss, low modulation efficiency, low modulation efficiency, etc.

Active Publication Date: 2020-07-03
ZHONGXING PHOTONICS TECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main problem of the current silicon-based high-speed carrier dispersion modulator is that the modulation efficiency is not high. For the modulator with a limited modulation region length, a high driving voltage is required to achieve the ideal modulation depth, which brings power consumption problem
Although the modulation efficiency can be improved to a certain extent by increasing the doping concentration, the optical loss caused by carrier absorption will increase sharply.
In addition, the modulation efficiency can also be improved by designing an "L-shaped" PN junction (that is, the shape of the PN junction depletion region is similar to the English letter "L"), although the overlapping area between the PN junction depletion region and the optical field is limited. A certain increase, but the modulation efficiency is still relatively low. In order to achieve higher modulation efficiency, relatively heavy doping is still required, which will inevitably bring higher optical loss

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon-based modulator and modulation device
  • Silicon-based modulator and modulation device
  • Silicon-based modulator and modulation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined arbitrarily with each other.

[0027] The steps shown in the flowcharts of the figures may be performed in a computer system, such as a set of computer-executable instructions. Also, although a logical order is shown in the flowcharts, in some cases the steps shown or described may be performed in an order different from that shown or described herein.

[0028] see figure 1 , an embodiment of the present invention proposes a silicon-based modulator, including:

[0029] A waveguide 100, the waveguide 100 comprising:

[0030] Positively doped region (P region) 111, negatively doped region (N region) 112, heavily positively doped region (P++ region) 113, heavily negatively doped region (N++ region) 114, cathode...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a silicon-based modulator and a modulation device. The modulator comprises a waveguide, and the waveguide comprises a positive doped region, a negative dopedregion, a heavy positive doped region, a heavy negative doped region, a cathode, and an anode, wherein the positive doped region is connected with the cathode through the heavy positive doped region,the negative doped region is connected with the anode through the heavy negative doped region, the positive doped region and the negative doped region form a positive-negative junction arranged in themiddle of the waveguide, the heavy positive doped region and the heavy negative doped region are arranged at the two ends of the waveguide, the cross section of an interface between the positive doped region and the negative doped region is a broken line, the broken line comprises n line segments, and n is greater than or equal to 3. According to the embodiment of the invention, the boundary between the positive doped region and the negative doped region is Z-shaped, so that the overlapping region area of the depletion region of the positive-negative junction formed by the positive doped region and the negative doped region and the light field is larger, the modulation efficiency is improved, the depletion region of the positive-negative junction does not need to be heavily doped, and theoptical loss is reduced.

Description

technical field [0001] Embodiments of the present invention relate to but are not limited to the field of optical communication, especially a silicon-based modulator and modulation device. Background technique [0002] With the development of computer and communication technology, the demand for information in modern society is increasing exponentially. As a strong competitor of communication link system based on copper materials, optical communication technology develops rapidly. [0003] A key device in the optical communication system is a high-speed modulator, which usually uses an external electric field to change the physical properties of the material, so that the output of the device exhibits characteristics that vary with the external electric field, and realizes data signals on the optical carrier. load. A typical modulator uses the linear electro-optic effect of lithium niobate material to modulate the optical carrier; materials such as indium phosphide and gall...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G02F1/21G02F1/225
CPCG02F1/218G02F1/225
Inventor 张森林邵永波李蒙
Owner ZHONGXING PHOTONICS TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More