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Light emitting device

A technology for transmitting devices and optical transmitting components, which is applied in the field of optical communication and can solve the problems of optical module size and reliability limitations

Active Publication Date: 2020-07-14
WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the improvement of the speed and integration of optical devices, the number of connection pads required continues to increase, and the spacing between pads continues to decrease. However, the use of pins or soft board connections has caused a great impact on the size and reliability of optical modules. very restrictive

Method used

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Embodiment Construction

[0029] Exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided for a more thorough understanding of the present application and for fully conveying the scope disclosed in the present application to those skilled in the art.

[0030] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features kno...

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Abstract

The embodiment of the invention discloses a light emitting device. The light emitting device comprises a light emitting assembly, a packaging structure and a printed circuit board, wherein the light emitting assembly is arranged in the packaging structure; the packaging structure comprises a ceramic part; the ceramic part and the printed circuit board are welded through ball mounting welding or welding flux layer coating, so the light emitting assembly is electrically connected with the printed circuit board through the ceramic part.

Description

technical field [0001] The present application relates to the technical field of optical communication, and in particular to an optical emitting device. Background technique [0002] With the rapid development of cloud computing and enterprise data centers, the demand for high-speed optical devices and optical modules such as 100G, 200G, and 400G is gradually increasing. The demand for integrating more and higher-rate optical devices in optical modules with limited space is becoming more and more urgent. An optical device in an existing optical module is connected to a printed circuit board (Printed Circuit Board, PCB) through pins or a flexible board. With the improvement of the speed and integration of optical devices, the number of connection pads required continues to increase, and the spacing between pads continues to decrease. However, the use of pins or soft board connections has caused a great impact on the size and reliability of optical modules. Very restrictive....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/067H05K1/18
CPCH01S3/06704H05K1/181H05K2201/10734
Inventor 宋小平宁静刘成刚肖清明
Owner WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD