Developed silicon wafer detection device used in semiconductor process

Abstract

The invention discloses a developed silicon wafer detection device used in semiconductor process, and the device comprises two line scanning cameras which are arranged in parallel, and the interior ofeach line scanning camera comprises a photosensitive element and an imaging lens. The long axes of the photosensitive elements of the two line scanning cameras are parallel and collinear; the long axis of the photosensitive element of each line scanning camera is perpendicular to and coplanar with the optical axis of the imaging lens; the linear motion platform moves in parallel with the opticalaxis direction of the imaging lens. The device also comprises two reflecting mirrors and two light sources. After the two light sources are incident to the silicon wafer, reflected light is reflectedby the second reflector and then reflected to the two imaging lenses arranged in parallel through the first reflector. The developed silicon wafer detection device can detect patterns and defects of the developed silicon wafer and improves the yield of the semiconductor process and has the characteristics of compact structure and high resolution.

Description

technical field [0001] The invention relates to the field of semiconductor detection, in particular to a silicon wafer detection device used in semiconductor technology after development. Background technique [0002] In the design, processing, manufacturing and production process of semiconductor integrated circuits, due to various factors, errors are difficult to avoid completely, resulting in lagging research and development progress, low product yield rate or even complete scrapping, and the losses are even more immeasurable. Designer's loopholes lead to mistakes in layout and wiring, differences in working conditions, defects in raw materials, and errors caused by engineers' misuse of machinery and equipment, all of which lead to circuit defects and eventually failure. Therefore, detection has become an important link throughout the design, manufacture and production of integrated circuits to ensure the quality of chips. [0003] The manufacturing process of semiconduc...

AI Technical Summary

Problems solved by technology

The increase of the magnification of the optical system will reduce the field of view, reduce the measurement speed, and it will take more time to measure the same sample

For example, every time the magnification of the optical system is doubled, the measurement time required by the system will be quadrupled, resulting in a decrease in the yield of semiconductor devices

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