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COC optical fiber automatic coupling and packaging device and method

An automatic coupling and packaging equipment technology, applied in laser welding equipment, welding equipment, welding equipment, etc., can solve the problems of high packaging cost, low coupling precision of tail fiber, and low product qualification rate, so as to reduce manual participation degree, reduce the probability of product damage, and improve the effect of utilization rate

Active Publication Date: 2020-07-31
CENT SOUTH UNIV
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Problems solved by technology

[0005] The invention provides a COC optical fiber automatic coupling packaging device and method, the purpose of which is to solve the existing problems of low production efficiency, low pigtail coupling precision, high packaging cost, and low product qualification rate

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  • COC optical fiber automatic coupling and packaging device and method
  • COC optical fiber automatic coupling and packaging device and method
  • COC optical fiber automatic coupling and packaging device and method

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Embodiment Construction

[0037] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0038] Aiming at the existing problems of low production efficiency, low pigtail coupling precision, high packaging cost and low product qualification rate, the invention provides a COC optical fiber automatic coupling packaging device.

[0039] Such as figure 1 , figure 2 , Figure 4 As shown, the embodiment of the present invention provides a COC optical fiber automatic coupling packaging device, including: installation platform 1, installation plate 2, arch beam structure 3, pigtail clamping mechanism 4, base clamping mechanism 5, power supply mechanism 6. Laser welding mechanism 7 and monitoring mechanism 8; the base clamping mechanism 5 is used for clamping the COC base 501, one end of the COC base 501 is provided with a pigtail installation slot...

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Abstract

The invention provides a COC optical fiber automatic coupling and packaging device and method. A base clamping mechanism is used for clamping a COC base, and the COC base is provided with a tail fibermounting groove, a laser chip and a lens. A tail fiber clamping mechanism is used for clamping the tail fiber and making the tail fiber coupled to the COC base, the tail fiber is composed of an optical fiber and a tail fiber fixing block, one end of the optical fiber penetrates through the tail fiber fixing block, and the other end of the optical fiber is connected with an optical power meter. Apower-up mechanism is used for supplying power to the laser chip, a monitoring mechanism is used for monitoring the relative position of the tail fiber and the COC base, and a laser welding mechanismis used for welding the tail fiber to the COC base. The method includes the steps of device clamping, optical fiber coupling, welding and fixing, and packaging. The device is reasonable in design, high in detection precision and high in equipment activation rate, the manual participation degree is reduced, the product damage phenomenon is avoided, and the production cost is effectively reduced.

Description

technical field [0001] The invention relates to the technical field of butterfly semiconductor laser production devices, in particular to a COC optical fiber automatic coupling packaging device and method. Background technique [0002] With the development of COC optical fiber communication and COC optical fiber sensing technology, the preparation of optoelectronic devices has become the key to the progress of optical information technology. In optical communication products, the demand for optoelectronic devices such as butterfly semiconductor lasers is increasing with the development. The butterfly semiconductor laser is the most commonly used long-distance transmission optical signal amplification device in the COC optical fiber communication industry. An important component, that is, the COC unit, needs to be installed in the butterfly semiconductor laser. [0003] The COC unit is composed of a base and a pigtail. The base part is pre-installed with a laser chip and a l...

Claims

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Application Information

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IPC IPC(8): B23K26/21B23K26/08B23K26/70B23K37/04
CPCB23K26/0884B23K37/0443B23K26/21B23K26/702
Inventor 段吉安唐佳卢胜强徐聪彭晋文
Owner CENT SOUTH UNIV
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