Soft magnetic powder capable of improving voltage resistance of mold pressing inductor, and manufacturing method thereof

Abstract

The invention discloses soft magnetic powder capable of improving the voltage resistance of a mold pressing inductor, and a manufacturing method thereof. According to the technical scheme of the invention, the soft magnetic powder comprises the following components in percentage by mass: 80-85% of iron powder; 2-2.3% of an adhesive; 0.1-1% of a ceramic material; and 10-16.5% of a diluent. The manufacturing method comprises the following steps: (1) putting the mixed adhesive and ceramic material into a container, and uniformly mixing; (2) mixing and uniformly stirring the mixed solution and iron powder in a closed container to form a semi-dry paste; (3) putting the obtained semi-dry paste into a screen granulator, and carrying out extrusion granulation to form a semi-finished product; (4) carrying out powder screening on the obtained semi-finished product through a vibrating screen machine to form a qualified product and recyclable waste; and (5) drying the qualified product by using drying equipment to form the product. According to the scheme provided by the invention, the reduction amplitude of the insulation resistance of the mold pressing inductor product after furnace passingcan be reduced, the manufacturing method is simple, and the manufacturing cost is low.

Description

technical field [0001] The invention relates to the technical field of soft magnetic materials used in molded inductors, in particular to a soft magnetic powder capable of improving the voltage resistance of molded inductors and a manufacturing method thereof. Background technique [0002] The soft magnetic powder core is a kind of metal soft magnetic material which is made by mixing and pressing ferromagnetic powder and insulating medium and has a distributed air gap. The device made by embedding the coil in the powder and then pressing together is called a molded inductor. [0003] At this stage, the inductors using compression molding have a phenomenon that the insulation resistance is greatly reduced under the conditions of SMD packaging-reflow furnace. With the development of electronic devices, the working voltage of molded inductors is getting higher and higher, and the working environment temperature is also getting higher and higher. The worse it is, when the induct...

AI Technical Summary

Problems solved by technology

[0003] At this stage, the inductors using compression molding have a phenomenon that the insulation resistance is greatly reduced under the conditions of SMD packaging-reflow furnace. With the development of electronic devices, the working voltage of molded inductors is getting higher and higher, and the working environment temperature is also getting higher and higher. The worse it is, when the inductance withstand voltage fails, it is very likely to cause a short circuit of the entire product, resulting in a serious burn-in accident. Therefore, finding a technology to reduce this change is of key significance for the future development of the molded inductor industry.