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Enhanced nickel plating process

A plating and nickel alloy technology, applied in metal material coating process, liquid chemical plating, electroplating to produce magnetic layers, etc., can solve problems such as poor rigidity and flatness, HDD disc chatter, etc.

Pending Publication Date: 2020-07-31
WESTERN DIGITAL TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional aluminum substrates have poor stiffness and flatness at thicknesses below 0.6 mm, and such downsized HDD platters may suffer from flutter (vibration during rotation) when made of aluminum

Method used

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  • Enhanced nickel plating process
  • Enhanced nickel plating process
  • Enhanced nickel plating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Embodiment 1: ENP process

[0050] In one embodiment, the ENP process described herein is performed under the conditions shown in Table 1 below.

[0051] Table 1

[0052]

Embodiment 2

[0053] Example 2: Effect of Surface Roughening

[0054] Sodium borosilicate glass surfaces were subjected to different treatments in order to determine the effect of surface roughening on the process of the invention. Surfaces were treated with CMP, grit blasting, ammonium bifluoride, or combinations thereof, and then plated as described in Example 1 above. After ENP, the adhesion of the magnetic layer to the glass surface was tested using a cross cut tape test (ASTM D3359). The results are shown in Table 2 below.

[0055] Table 2

[0056] CMP sandblasting only Dicyandiamide only result - - - Magnetic layers are stripped prior to testing - - + Magnetic layers are stripped prior to testing - + - pass + - - pass + + pass + - + Magnetic layers are stripped prior to testing

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PUM

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Abstract

A method for plating nickel onto a glass surface of a substrate by sequentially contacting the surface with a solution having an oxidizing agent, a solution containing a silane compound, a Pd / Sn solution, and a nickel ion-containing solution, thereby accomplishing an electroless nickel plating process.

Description

[0001] Cross References to Related Applications [0002] This patent application claims U.S. Patent Application 16 / 676,344, filed November 6, 2019, entitled "ENHANCED NICKEL PLATING PROCESS" and U.S. Patent Application 62 / 757,658, the entire contents of these two patent applications are incorporated herein by reference. technical field [0003] The present invention relates generally to electroless nickel plating of glass substrates, particularly substrates used in magnetic recording media such as hard disk drives. Background technique [0004] Electroless nickel plating ("ENP") is a process for depositing a layer of nickel or nickel alloys on the surface of a solid substrate. The process typically involves immersing the substrate in a bath of plating solution containing nickel ions. Reducing agents such as sodium hypophosphite hydrate (NaPO 2 h 2 ·H 2 O) React with the surface material of the substrate to deposit nickel or nickel alloy. [0005] Aluminum is often use...

Claims

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Application Information

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IPC IPC(8): C23C18/54C23C18/16G11B5/858
CPCG11B5/8404C03C17/36C03C17/3607C03C17/3642C03C17/3649C03C17/3697G11B5/73921C03C2218/31C03C2217/254C03C2218/11C03C2217/261C23C18/1651C23C18/1855C23C18/1893C23C18/32C23C18/36
Inventor M·A·阿卜杜勒瓦迪S·M·刘S·L·林
Owner WESTERN DIGITAL TECH INC
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