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A wafer-level test device for temperature sensor liquid environment

A temperature sensor and liquid environment technology, applied in measuring devices, electronic circuit testing, instruments, etc., can solve the problems of small number of tests, low efficiency, long time, etc., and achieve excellent safety and heat conduction, reduce time, and improve test efficiency. Effect

Active Publication Date: 2021-01-05
JIANGSU SEVEN DIMENSIONAL TEST TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the embodiment of the present invention provides a temperature sensor liquid environment wafer-level test device to solve the problems of a small number of tests, a long time and low efficiency in the temperature sensor test in the prior art.

Method used

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  • A wafer-level test device for temperature sensor liquid environment
  • A wafer-level test device for temperature sensor liquid environment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] This embodiment provides a temperature sensor liquid environment wafer-level testing device, including a tester 1, a probe card equipped with a plurality of probes 3a, a platform 5 for carrying a temperature sensor wafer 4 to be tested, and A container 7 storing insulating and heat-conducting oil 6, the tester 1 is connected to the end of the probe 3a through a wire 2, the probe 3a corresponds to the temperature sensor wafer 4 to be tested, and the probe 3a 1. The temperature sensor wafer 4 to be tested and the platform 5 are submerged in the insulating heat-conducting oil 6 .

[0026] Preferably, the temperature sensor liquid environment wafer-level test device also includes a bundle tube sleeved on the wires, the top of the probe card 3 is provided with a through groove, and the wires 2 at the ends of the probes 3a pass through them in turn. The through groove and the bundle tube are connected with the tester 1, and the smoothness of the whole device can be improved b...

Embodiment 2

[0028] On the basis of Example 1, the raw materials for preparing the insulating heat transfer oil include cyclic body, phenyl oligomer, end-capping agent, catalyst and antioxidant, and the parts by weight of each component are 50 parts by weight of cyclic body , 18 parts of phenyl oligomer, 4 parts of end-capping agent, 0.5 part of catalyst, and 0.01 part of antioxidant. Preferably, the capping agent includes any one or a combination of two or more of phenol, ketoxime, alcohol, caprolactam and malonate. Preferably, the catalyst includes any one or a combination of two or more of organotin compounds and zinc octoate. Preferably, the antioxidant includes any one or a combination of two or more of butyl hydroxyanisole and 2,6-di-tert-butyl-4-methylphenol.

[0029] Example 2

[0030] On the basis of Example 1, the raw materials for preparing the insulating heat transfer oil include cyclic body, phenyl oligomer, end-capping agent, catalyst and antioxidant, and the parts by weigh...

Embodiment 3

[0032] On the basis of Example 1, the raw materials for preparing the insulating heat transfer oil include cyclic body, phenyl oligomer, end-capping agent, catalyst and antioxidant, and the parts by weight of each component are 55 parts by weight of cyclic body , 20 parts of phenyl oligomer, 5 parts of end-capping agent, 0.75 part of catalyst, and 0.02 part of antioxidant. Preferably, the capping agent includes any one or a combination of two or more of phenol, ketoxime, alcohol, caprolactam and malonate. Preferably, the catalyst includes any one or a combination of two or more of organotin compounds and zinc octoate. Preferably, the antioxidant includes any one or a combination of two or more of butyl hydroxyanisole and 2,6-di-tert-butyl-4-methylphenol.

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Abstract

The embodiment of the invention discloses a wafer level testing device of a temperature sensor liquid environment. The wafer level testing device comprises a tester, a probe card provided with a plurality of probes, a table disc used for bearing a to-be-tested temperature sensor wafer, and a container storing insulating heat conduction oil. The tester is connected with the end parts of the probesthrough wires, the probes correspond to a to-be-tested temperature sensor wafer, and the probes, the to-be-tested temperature sensor wafer and the table disc are immersed in the insulating heat conduction oil. According to the wafer level testing device provided by the embodiment of the invention, the plurality of probes on the probe card can be in one-to-one correspondence with the number of chips required to be tested at a time by selecting the probe card, and a plurality of sensors can be tested at a time, so that the testing efficiency is improved, and the time is shortened.

Description

technical field [0001] The invention belongs to the field of micro-electromechanical sensors, in particular to a wafer-level testing device for a temperature sensor liquid environment. Background technique [0002] Temperature is a physical quantity that characterizes the degree of coldness and heat of an object, and is a very important and common measurement parameter in the process of industrial and agricultural production. Temperature measurement and control play a very important role in ensuring product quality, improving production efficiency, saving energy, production safety, and promoting the development of the national economy. Due to the universality of temperature measurement, the number of temperature sensors ranks first among all kinds of sensors, accounting for about 50%. A temperature sensor refers to a sensor that can sense temperature and convert it into a usable output signal. It is the core part of a temperature measuring instrument and has a wide variety....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2806G01R31/2817G01R31/2829
Inventor 杭晓宇邹桂明常兵何芹孔令丰
Owner JIANGSU SEVEN DIMENSIONAL TEST TECH CO LTD
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