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Temperature sensor liquid environment wafer level test method

A temperature sensor and liquid environment technology, applied in thermometer testing/calibration, thermometers, instruments, etc., can solve problems such as long time, low efficiency, and small number of tests at a time, and achieve time reduction, improve test efficiency, and excellent heat conduction safety Effect

Inactive Publication Date: 2020-07-10
JIANGSU SEVEN DIMENSIONAL TEST TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the embodiment of the present invention provides a wafer-level test method for a temperature sensor in a liquid environment to solve the problems of a small number of tests, a long time, and low efficiency when testing a temperature sensor in the prior art.

Method used

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  • Temperature sensor liquid environment wafer level test method
  • Temperature sensor liquid environment wafer level test method
  • Temperature sensor liquid environment wafer level test method

Examples

Experimental program
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Embodiment 1

[0026] This embodiment provides a temperature sensor liquid environment wafer-level testing device, including a tester 1, a probe card equipped with a plurality of probes 3a, a platform 5 for carrying a temperature sensor wafer 4 to be tested, and A container 7 storing insulating and heat-conducting oil 6, the tester 1 is connected to the end of the probe 3a through a wire 2, the probe 3a corresponds to the temperature sensor wafer 4 to be tested, and the probe 3a 1. The temperature sensor wafer 4 to be tested and the platform 5 are submerged in the insulating heat-conducting oil 6 .

[0027] Preferably, the temperature sensor liquid environment wafer-level test device also includes a bundle tube sleeved on the wires, the top of the probe card 3 is provided with a through groove, and the wires 2 at the ends of the probes 3a pass through them in turn. The through groove and the bundle tube are connected with the tester 1, and the smoothness of the whole device can be improved b...

Embodiment 2

[0030] On the basis of Example 1, the raw materials for preparing the insulating heat transfer oil include cyclic body, phenyl oligomer, end-capping agent, catalyst and antioxidant, and the parts by weight of each component are 50 parts by weight of cyclic body , 18 parts of phenyl oligomer, 4 parts of end-capping agent, 0.5 part of catalyst, and 0.01 part of antioxidant. Preferably, the capping agent includes any one or a combination of two or more of phenol, ketoxime, alcohol, caprolactam and malonate. Preferably, the catalyst includes any one or a combination of two or more of organotin compounds and zinc octoate. Preferably, the antioxidant includes any one or a combination of two or more of butyl hydroxyanisole and 2,6-di-tert-butyl-4-methylphenol.

[0031] Example 2

[0032] On the basis of Example 1, the raw materials for preparing the insulating heat transfer oil include cyclic body, phenyl oligomer, end-capping agent, catalyst and antioxidant, and the parts by weigh...

Embodiment 3

[0034] On the basis of Example 1, the raw materials for preparing the insulating heat transfer oil include cyclic body, phenyl oligomer, end-capping agent, catalyst and antioxidant, and the parts by weight of each component are 55 parts by weight of cyclic body , 20 parts of phenyl oligomer, 5 parts of end-capping agent, 0.75 part of catalyst, and 0.02 part of antioxidant. Preferably, the capping agent includes any one or a combination of two or more of phenol, ketoxime, alcohol, caprolactam and malonate. Preferably, the catalyst includes any one or a combination of two or more of organotin compounds and zinc octoate. Preferably, the antioxidant includes any one or a combination of two or more of butyl hydroxyanisole and 2,6-di-tert-butyl-4-methylphenol.

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Abstract

The embodiment of the invention discloses a temperature sensor liquid environment wafer level test method. The temperature sensor liquid environment wafer level test device comprises a tester, a probecard provided with a plurality of probes, a table disc used for bearing a temperature sensor wafer to be tested, and a container storing insulating heat conduction oil. The tester is connected with the end part of the probe through a wire, the probe corresponds to a to-be-tested temperature sensor wafer, and the probe, the to-be-tested temperature sensor wafer and the table disc are immersed in the insulating heat conduction oil. According to the temperature sensor liquid environment wafer level test device, a plurality of probes on the probe card can be in one-to-one correspondence with thenumber of chips required to be tested at a time by selecting the probe card, and a plurality of sensors can be tested at a time so that the testing efficiency is improved and the time is shortened.

Description

technical field [0001] The invention belongs to the field of micro-electromechanical sensors, in particular to a wafer-level testing method for a temperature sensor in a liquid environment. Background technique [0002] Temperature is a physical quantity that characterizes the degree of coldness and heat of an object, and is a very important and common measurement parameter in the process of industrial and agricultural production. Temperature measurement and control play a very important role in ensuring product quality, improving production efficiency, saving energy, production safety, and promoting the development of the national economy. Due to the universality of temperature measurement, the number of temperature sensors ranks first among all kinds of sensors, accounting for about 50%. A temperature sensor refers to a sensor that can sense temperature and convert it into a usable output signal. It is the core part of a temperature measuring instrument and has a wide var...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K15/00
CPCG01K15/007
Inventor 杭晓宇陈元钊何芹齐和峰邵春健
Owner JIANGSU SEVEN DIMENSIONAL TEST TECH CO LTD
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